SCHEMBL440389

SCHEMBL440389

CC1(C)CCC(C)(c2ccccc2)N1O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.40
OPRM1 P35372 6/20 0.38
OPRL1 P41146 4/20 0.38
OPRK1 P41145 3/20 0.38
DRD4 P21917 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
LMNA P02545 1/20 0.35
GAA P10253 1/20 0.35
PAX8 Q06710 1/20 0.35
MCL1 Q07820 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
GRIN2D O15399 1/20 0.35
GRIN3B O60391 1/20 0.35
CHRM2 P08172 1/20 0.35
CHRM1 P11229 1/20 0.35
GRIN1 Q05586 1/20 0.35
KCNH2 Q12809 1/20 0.35
GRIN2A Q12879 1/20 0.35
GRIN2B Q13224 1/20 0.35
GRIN2C Q14957 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3389800 0.90 ALDH1A1 (0.43) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL444598 0.89 ALDH1A1 (0.38) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL5466007 0.82 ALDH1A1 (0.41) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL440388 0.76 ALDH1A1 (0.40) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL10170130 0.74 OPRM1 (0.45) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL19370860 0.73 KMT2A (0.35) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL3389799 0.72 ALDH1A1 (0.43) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL14369406 0.71 OPRM1 (0.43) ALDH1A1OPRM1OPRL1LMNAL3MBTL1
SCHEMBL23355097 0.71 ALDH1A1 (0.39) ALDH1A1OPRM1OPRL1OPRK1DRD4
SCHEMBL3904043 0.71 ALDH1A1 (0.36) ALDH1A1SMN1; SMN2LMNAGAAPAX8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US disclosed
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US disclosed
US-20110176288-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY LTD. (JP) 2011-07-21 US disclosed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP disclosed
EP-1754762-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2007-02-21 EP disclosed