SCHEMBL4407359

SCHEMBL4407359

C=CCOS(=O)(=O)OC(N)CC

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.31
CA9 Q16790 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18857454 0.80 TSHR (0.32) CA2CA9
SCHEMBL10729404 0.77 CA1 (0.32) CA2CA9
SCHEMBL6692764 0.76 ALDH1A1 (0.37) CA2CA9
SCHEMBL20526044 0.75 CA2 (0.37) CA2CA9
SCHEMBL6406663 0.74 CA2 (0.37) CA2CA9
SCHEMBL8918640 0.74 TSHR (0.34)
SCHEMBL5341332 0.73 CA2 (0.32) CA2CA9
Methylethylamine SCHEMBL28981569 0.72 CA2 (0.30) CA2CA9
SCHEMBL29656 0.72 CA2 (0.39) CA2CA9
SCHEMBL8994524 0.71 TSHR (0.38) CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2212397-B1 SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING OF METAL AND POLISHING METHOD USING THE SAME CHEIL IND INC (KR) 2019-10-30 EP disclosed
US-9695347-B2 Slurry composition for chemical mechanical polishing of metal and polishing method using the same SAMSUNG SDI CO., LTD. (KR) 2017-07-04 US disclosed
US-20090095939-A1 Slurry Composition for Chemical Mechanical Polishing of Metal and Polishing Method Using the Same CHEIL INDUSTRIES INC. (KR) 2009-04-16 US disclosed