SCHEMBL4409283

SCHEMBL4409283

CCCCOC(=O)OC(=O)c1ccccc1Oc1ccccc1C(=O)OC(=O)OCCCC

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 9/20 0.61
TDP1 Q9NUW8 2/20 0.61
L3MBTL1 Q9Y468 2/20 0.61
MAPK1 P28482 4/20 0.55
CYP3A4 P08684 4/20 0.55
TP53 P04637 1/20 0.55
ALDH1A1 P00352 7/20 0.54
LMNA P02545 4/20 0.54
HSD17B10 Q99714 2/20 0.54
ELANE P08246 2/20 0.50
SMN1; SMN2 Q16637 3/20 0.48
CYP1A2 P05177 3/20 0.48
CYP2C19 P33261 3/20 0.48
KDM4E B2RXH2 3/20 0.48
POLB P06746 1/20 0.48
MAPT P10636 2/20 0.47
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
NR1I2 O75469 1/20 0.46
CHRM2 P08172 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27716153 0.85 TSHR (0.66) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL28348514 0.85 TSHR (0.66) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL1006617 0.84 LMNA (0.59) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL28177357 0.84 ALDH1A1 (0.76) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL4398193 0.82 TSHR (0.71) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL28811038 0.81 LMNA (0.62) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL1913669 0.81 TSHR (0.59) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL1282684 0.80 TSHR (0.73) TSHRTDP1L3MBTL1MAPK1CYP3A4
SCHEMBL975212 0.80 TSHR (0.77) TSHRTDP1L3MBTL1MAPK1CYP3A4
Hydrogen Peroxide SCHEMBL28876079 0.80 LMNA (0.59) TSHRTDP1L3MBTL1MAPK1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1508837-B1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM TORAY INDUSTRIES (JP) 2014-10-15 EP disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 EP disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 US disclosed
US-20050202337-A1 Photosensitive resin composition and method for preparing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2005-09-15 US disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
EP-1508837-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM TORAY INDUSTRIES, INC. (JP) 2005-02-23 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed