Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.42 |
| ▸ | MAPT | P10636 | 2/20 | 0.42 |
| ▸ | PRSS1 | P07477 | 2/20 | 0.42 |
| ▸ | ACR | P10323 | 2/20 | 0.42 |
| ▸ | POLB | P06746 | 3/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | USP2 | O75604 | 1/20 | 0.40 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.40 |
| ▸ | CDC25A | P30304 | 1/20 | 0.40 |
| ▸ | CDC25B | P30305 | 1/20 | 0.40 |
| ▸ | HPSE | Q9Y251 | 1/20 | 0.39 |
| ▸ | APEX1 | P27695 | 1/20 | 0.38 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31541190 | 1.00 | L3MBTL1 (0.42) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL9129348 | 0.93 | L3MBTL1 (0.40) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL10442448 | 0.86 | L3MBTL1 (0.40) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL9129524 | 0.86 | L3MBTL1 (0.42) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL27676005 | 0.85 | L3MBTL1 (0.40) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL11848517 | 0.85 | HSD17B10 (0.52) | L3MBTL1TDP1MAPTPRSS1POLB | |
| SCHEMBL9129657 | 0.85 | L3MBTL1 (0.41) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL9132415 | 0.85 | L3MBTL1 (0.41) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL9131432 | 0.85 | L3MBTL1 (0.41) | L3MBTL1TDP1MAPTPRSS1ACR | |
| SCHEMBL10442499 | 0.84 | PRSS1 (0.39) | L3MBTL1TDP1MAPTPRSS1ACR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0142149-B1 | Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. | HITACHI LTD (JP) | 1995-02-01 | — | — | EP | claimed |
| US-4760126-A | Fluorine-containing polyamide-acid derivative and polyimide | HITACHI, LTD. (JP) | 1988-07-26 | — | — | US | claimed |
| EP-0142149-A2 | Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. | HITACHI, LTD. (JP) | 1985-05-22 | — | — | EP | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-12384885-B2 | Support substrate for display device, organic EL display device, and manufacturing method for organic EL display device | LG CHEM, LTD. (KR) | 2025-08-12 | — | — | US | disclosed |
| US-20010015484-A1 | Heat -resistant adhesive sheet | MATSUURA HIDEKAZU (JP) | 2001-08-23 | — | — | US | disclosed |
| US-6248613-B1 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-06-19 | — | — | US | disclosed |
| US-6046072-A | BONDING A SEMICONDUCTOR CHIP TO A LEAD FRAME WITH ADHESIVE MEMBER HAVING LOW MOISTURE ABSORBING, LOW FLOW ADHESIVE AND ENCAPSULATING PACKAGE WITH SEALANT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-04-04 | — | — | US | disclosed |
| EP-0618614-B1 | Heat-resistant adhesive for the fabrication of a semiconductor package | HITACHI CHEMICAL CO LTD (JP) | 1999-01-07 | — | — | EP | disclosed |
| EP-0862205-A1 | Heat-resistant adhesive | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-02 | — | — | EP | disclosed |
| EP-0142149-B1 | Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. | HITACHI LTD (JP) | 1995-02-01 | — | — | EP | disclosed |
| EP-0618614-A2 | Heat-resistant adhesive for the fabrication of a semiconductor package | Hitachi Chemical Co., Ltd. (JP) | 1994-10-05 | — | — | EP | disclosed |
| US-4760126-A | Fluorine-containing polyamide-acid derivative and polyimide | HITACHI, LTD. (JP) | 1988-07-26 | — | — | US | disclosed |
| EP-0142149-A2 | Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. | HITACHI, LTD. (JP) | 1985-05-22 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | L3MBTL1 2505/4885TDP1 2545/4885MAPT 1027/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | L3MBTL1 2864/4885TDP1 563/4885MAPT 784/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.