SCHEMBL4412484

SCHEMBL4412484

O=[PH](OCCC(Cl)CCl)OCCC(Cl)CCl

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.31
TSHR P16473 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4410150 0.86
SCHEMBL4405165 0.75 TP53 (0.33) TP53TSHRTDP1
SCHEMBL2657057 0.71 TP53 (0.38) TP53TSHRTDP1
SCHEMBL315508 0.68 ALDH1A1 (0.36) TP53
SCHEMBL11314080 0.68 ALDH1A1 (0.36) TP53
SCHEMBL28133224 0.67
SCHEMBL4947867 0.67 ALDH1A1 (0.44) TDP1
SCHEMBL7516996 0.66 TP53 (0.50) TP53TSHRTDP1
SCHEMBL10612367 0.65
SCHEMBL11063662 0.65 TP53 (0.46) TP53TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed