SCHEMBL4415372

SCHEMBL4415372

CCCCc1cccc(C2CCC(O)CC2C)c1

nearest known ligand 0.41

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ VDR P11473 2/20 0.41
▸ CNR1 P21554 1/20 0.41
▸ CNR2 P34972 1/20 0.41
▸ S1PR3 Q99500 1/20 0.39
▸ SPHK2 Q9NRA0 3/20 0.39
▸ SPHK1 Q9NYA1 2/20 0.39
▸ LPL P06858 2/20 0.38
▸ LIPG Q9Y5X9 2/20 0.38
▸ SLC5A1 P13866 1/20 0.37
▸ SLC5A2 P31639 1/20 0.37
▸ DRD2 P14416 1/20 0.36
▸ DRD1 P21728 1/20 0.36
▸ DRD4 P21917 1/20 0.36
▸ DRD5 P21918 1/20 0.36
▸ DRD3 P35462 1/20 0.36
▸ CHRNB4 P30926 1/20 0.36
▸ CHRNA3 P32297 1/20 0.36
▸ NAMPT P43490 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11828822 0.68 HTR2C (0.55) S1PR3SPHK1DRD2DRD1DRD4
SCHEMBL28359944 0.68 CNR2 (0.49) CNR2SPHK2SPHK1
SCHEMBL20671885 0.68 DRD2 (0.43) DRD2DRD1DRD4DRD5DRD3
SCHEMBL27545610 0.67 DRD2 (0.55) S1PR3SPHK2SPHK1LPLLIPG
SCHEMBL347126 0.67 LPL (0.57) LPLLIPG
SCHEMBL26462700 0.67 DRD3 (0.51) S1PR3DRD2DRD1DRD4DRD5
SCHEMBL5271487 0.66 SPHK2 (0.52) S1PR3SPHK2SPHK1LPLLIPG
SCHEMBL5666443 0.66 DRD2 (0.53) S1PR3SPHK1LPLLIPGDRD2
SCHEMBL10551231 0.66 SPHK1 (0.40) S1PR3SPHK2SPHK1NAMPT
SCHEMBL10556730 0.65 SPHK1 (0.43) S1PR3SPHK2SPHK1NAMPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108025574-A Thermal recording medium 三光株式会社 2018-05-11 — — CN disclosed
CN-107614277-A Thermosensitive recording body with the intermediate layer comprising hollow particle 赛登化学株式会社 2018-01-19 — — CN disclosed
EP-2062953-A1 Heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2009-05-27 — — EP disclosed
EP-1882726-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2008-01-30 — — EP disclosed
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