Zinc Ion

Zinc Ion

SCHEMBL442188

[N-3].[N-3].[O-2].[O-2].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[Zn+2]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Zinc Ion SCHEMBL2402555 0.87
Zinc Ion SCHEMBL319919 0.87
Zinc Ion SCHEMBL15813264 0.87
Zinc Ion SCHEMBL8057600 0.82 GPR39 (0.33)
Zinc Ion SCHEMBL21753941 0.82
Zinc Ion SCHEMBL8057707 0.82 GPR39 (0.33)
SCHEMBL454133 0.82
SCHEMBL21273333 0.82
Zinc Ion SCHEMBL9522649 0.82 GPR39 (0.33)
Zinc Ion SCHEMBL14809810 0.82 GPR39 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 341 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024118599-A1 MEMORY DEVICE HAVING TIERS OF 2-TRANSISTOR MEMORY CELLS MICRON TECHNOLOGY, INC. (US) 2024-06-06 WO claimed
US-20240188273-A1 MEMORY DEVICE HAVING TIERS OF 2-TRANSISTOR MEMORY CELLS MICRON TECHNOLOGY, INC. 2024-06-06 US claimed
US-11985806-B2 Vertical 2-transistor memory cell MICRON TECHNOLOGY, INC. (US) 2024-05-14 US claimed
US-11950426-B2 Memory device having 2-transistor vertical memory cell and wrapped data line structure MICRON TECHNOLOGY, INC. (US) 2024-04-02 US claimed
US-11950402-B2 Memory device having 2-transistor vertical memory cell and shield structures MICRON TECHNOLOGY, INC. (US) 2024-04-02 US claimed
US-20240074138-A1 MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND SEPARATE READ AND WRITE DATA LINES MICRON TECHNOLOGY, INC. 2024-02-29 US claimed
US-20240074211-A1 MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND MEMORY ELEMENT BETWEEN CHANNEL REGION AND CONDUCTIVE PLATE MICRON TECHNOLOGY, INC. 2024-02-29 US claimed
US-20240047356-A1 MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND A COMMON PLATE MICRON TECHNOLOGY INC (US) 2024-02-08 US claimed
US-20230422471-A1 MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND SEPARATE READ AND WRITE GATES MICRON TECHNOLOGY INC (US) 2023-12-28 US claimed
US-11776907-B2 Memory device having 2-transistor vertical memory cell and a common plate MICRON TECHNOLOGY, INC. (US) 2023-10-03 US claimed
US-8669150-B2 Semiconductor device with reliable high-voltage gate oxide and method of manufacture thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2014-03-11 US claimed
US-8609460-B2 Semiconductor structure and fabricating method thereof AU OPTRONICS CORPORATION (TW) 2013-12-17 US claimed
US-20130130451-A1 Semiconductor Device with Reliable High-Voltage Gate Oxide and Method of Manufacture Thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2013-05-23 US claimed
US-8338243-B2 Semiconductor device with reliable high-voltage gate oxide and method of manufacture thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2012-12-25 US claimed
CN-101997037-B Semiconductor structure and manufacturing method thereof AU OPTRONICS CORP 2012-07-04 CN claimed
US-20120061661-A1 SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF AU OPTRONICS CORPORATION (TW) 2012-03-15 US claimed
US-20110212585-A1 Semiconductor Device with Reliable High-Voltage Gate Oxide and Method of Manufacture Thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2011-09-01 US claimed
US-7960810-B2 Semiconductor device with reliable high-voltage gate oxide and method of manufacture thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2011-06-14 US claimed
CN-101997037-A Semiconductor structure and manufacturing method thereof AU OPTRONICS CORP 2011-03-30 CN claimed
US-20080054399-A1 Semiconductor device with reliable high-voltage gate oxide and method of manufacture thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 2008-03-06 US claimed