SCHEMBL4426634

SCHEMBL4426634

CC1=C(C)C(C)(C)C([Zr](C)(Cl)C2=C(C)C(C)=C(C)C2(C)C)=C1C

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CTSD P07339 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6856810 0.85 CTSD (0.30) CTSD
SCHEMBL4430418 0.82 CTSD (0.31) CTSD
SCHEMBL4430868 0.82 CTSD (0.31) CTSD
SCHEMBL258135 0.79 CTSD (0.32) CTSD
SCHEMBL4428442 0.79 CTSD (0.32) CTSD
SCHEMBL6857335 0.75
SCHEMBL6857283 0.71
SCHEMBL28650697 0.71
SCHEMBL4434352 0.68
SCHEMBL8378955 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
EP-0818472-B2 Cyclic olefin copolymers, compositions and molded articles comprising the copolymers IDEMITSU KOSAN CO (JP) 2009-07-29 EP disclosed
US-7531605-B2 Process for producing polyolefin resin composition and polypropylene composition IDEMITSU KOSAN CO., LTD. (JP) 2009-05-12 US disclosed
EP-1375538-B1 PROCESS FOR PRODUCING POLYOLEFIN RESIN COMPOSITION AND POLYPROPYLENE COMPOSITION IDEMITSU KOSAN CO (JP) 2008-01-09 EP disclosed
US-5418276-A Styrene copolymer, syndiotactic, heat resistance, chemical resistance IDEMITSU KOSAN CO., LTD. (JP) 1995-05-23 US disclosed
US-5418290-A Compatability with other resins, adhesion IDEMITSU KOSAN CO., LTD. (JP) 1995-05-23 US disclosed
US-5391626-A Syndiotactic, high performance, compatibility and adhesiveness; molding materials IDEMITSU KOSAN CO., LTD. (JP) 1995-02-21 US disclosed
US-5369196-A Production process of olefin based polymers IDEMITSU KOSAN CO., LTD. (JP) 1994-11-29 US disclosed
US-5362814-A Styrene polymers with olefin monomers and diolefin monomers for impact strength in molding materials IDEMITSU KOSAN CO., LTD. (JP) 1994-11-08 US disclosed
EP-0570931-A2 Styrenic polymer, process for producing same and multi-layer material comprising same IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-11-24 EP disclosed
EP-0570932-A2 Styrenic block copolymer and process for producing same IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-11-24 EP disclosed
EP-0559108-A1 Graft copolymer, process for production thereof and resin composition containing same IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-09-08 EP disclosed
EP-0513380-A1 PROCESS FOR PRODUCING OLEFINIC POLYMER IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-11-19 EP disclosed
EP-0504418-A1 PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER, CYCLOOLEFIN COPOLYMER, AND COMPOSITION AND MOLDING PREPARED THEREFROM IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-09-23 EP disclosed