SCHEMBL4428879

SCHEMBL4428879

C=CC(C)(O)CCCCCCCCC

nearest known ligand 0.50

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 3/20 0.50
MEN1 O00255 1/20 0.50
CYP3A4 P08684 1/20 0.50
KMT2A Q03164 1/20 0.50
FDPS P14324 9/20 0.42
GGPS1 O95749 7/20 0.42
TSHR P16473 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9306274 1.00 ALOX15 (0.50) ALOX15MEN1CYP3A4KMT2AFDPS
SCHEMBL4591909 1.00 ALOX15 (0.50) ALOX15MEN1CYP3A4KMT2AFDPS
SCHEMBL2368497 1.00 ALOX15 (0.50) ALOX15MEN1CYP3A4KMT2AFDPS
SCHEMBL294887 0.98 ALOX15 (0.52) ALOX15MEN1CYP3A4KMT2AFDPS
SCHEMBL28857285 0.91
SCHEMBL13384409 0.91
SCHEMBL15333382 0.86 FDPS (0.45) MEN1KMT2AFDPSGGPS1TSHR
SCHEMBL15333380 0.86 FDPS (0.45) MEN1KMT2AFDPSGGPS1TSHR
Catechol SCHEMBL28016414 0.82 CNR1 (0.43) ALOX15MEN1CYP3A4KMT2A
Linalool SCHEMBL28837816 0.81 ALOX15 (0.79) ALOX15MEN1CYP3A4KMT2AFDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120058807-A Platinum complex and preparation method and application thereof 广东盛唐新材料技术有限公司 2025-05-30 CN disclosed
CN-115491038-B Halogen-free platinum flame retardant for silicone rubber and preparation method thereof 广州市矽友新材料科技有限公司 2024-08-09 CN disclosed
CN-113913024-B Addition type liquid silicone rubber, vulcanized rubber and preparation method thereof 南通万德科技有限公司 2023-05-30 CN disclosed
CN-114196374-B High AF screen adhesive force organic silicon pressure-sensitive adhesive applicable to TPU film general curing, preparation method and application thereof 万华化学集团股份有限公司 2023-05-30 CN disclosed
CN-108070261-B Heat-curable silicon-oxygen composition, die-bonding material, and optical semiconductor device 信越化学工业株式会社 2021-06-18 CN disclosed
US-20090298367-A1 Fibrous Support Comprising A Silicone Coating RHODIA RECHERCHE ET TECHNOLOGIES (FR) 2009-12-03 US disclosed