SCHEMBL4430703

SCHEMBL4430703

C=CC(N)C(C)c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ADRA2A P08913 1/20 0.43
ADRA2C P18825 1/20 0.43
LMNA P02545 1/20 0.43
HIF1A Q16665 1/20 0.43
KDM4E B2RXH2 1/20 0.43
DPP4 P27487 2/20 0.42
F2 P00734 1/20 0.42
ALDH1A1 P00352 1/20 0.42
TAAR1 Q96RJ0 3/20 0.40
AOC3 Q16853 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10196964 0.78 ADRA2A (0.43) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL9205897 0.77 DPP4 (0.50) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL10348035 0.76 LMNA (0.46) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL4631655 0.76 DPP4 (0.44) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL17300288 0.76 DPP4 (0.56) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL17300289 0.76 DPP4 (0.56) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL8634102 0.76 DPP4 (0.56) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL11789068 0.74 KDM4E (0.54) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL19165393 0.74 LMNA (0.48) ADRA2AADRA2CLMNAHIF1AKDM4E
SCHEMBL19711876 0.74 LMNA (0.48) ADRA2AADRA2CLMNAHIF1AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090267263-A1 THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO.,LTD. 2009-10-29 US disclosed
US-20090256283-A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. 2009-10-15 US disclosed
US-20070148442-A1 Thermosetting resin composition, material for substrate and film for substrate SEKISUI CHEMICAL CO., LTD. (JP) 2007-06-28 US disclosed
US-20070072963-A1 Thermoplastic resin composition, material for substrate and film for substrate SEKISUI CHEMICAL CO., LTD. (JP) 2007-03-29 US disclosed
EP-1698670-A1 THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. (JP) 2006-09-06 EP disclosed
EP-1696003-A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. (JP) 2006-08-30 EP disclosed