SCHEMBL4430706

SCHEMBL4430706

CNCC=CCc1ccccc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.68
KDM4E B2RXH2 1/20 0.48
CYP3A4 P08684 1/20 0.48
MAPT P10636 1/20 0.48
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
ARG2 P78540 1/20 0.47
TAAR1 Q96RJ0 3/20 0.46
ATM Q13315 1/20 0.46
TOP1 P11387 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.42
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
CALM1 P0DP23 1/20 0.42
KCNH2 Q12809 2/20 0.41
SIGMAR1 Q99720 2/20 0.41
MAPK1 P28482 1/20 0.40
SLC18A2 Q05940 1/20 0.39
LMNA P02545 1/20 0.39
CYP2D6 P10635 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL155054 0.83 MAOB (1.00) MAOBCA1CA2ARG2TAAR1
SCHEMBL1524697 0.83 MAOB (1.00) MAOBCA1CA2ARG2TAAR1
SCHEMBL155055 0.83 MAOB (1.00) MAOBCA1CA2ARG2TAAR1
SCHEMBL4065926 0.82 KDM4E (0.48) MAOBKDM4ECYP3A4MAPTCA1
SCHEMBL21637548 0.77 MAOB (0.61) MAOBKDM4ECYP3A4MAPTCA1
SCHEMBL13373175 0.77 MAOB (0.61) MAOBKDM4ECYP3A4MAPTCA1
SCHEMBL8761329 0.77 MAOB (0.60) MAOBKDM4ECYP3A4MAPTCA1
SCHEMBL4136168 0.77 CYP2D6 (0.48) L3MBTL1MEN1KMT2ACYP2D6
SCHEMBL106848 0.76 MAOB (0.75) MAOBCA1CA2ARG2TOP1
SCHEMBL18648467 0.76 MAOB (0.75) MAOBCA1CA2ARG2TOP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116133865-A Aqueous inkjet ink and method for printing fiber structure by inkjet method 山阳色素株式会社 2023-05-16 CN disclosed
US-20090267263-A1 THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO.,LTD. 2009-10-29 US disclosed
US-20090256283-A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. 2009-10-15 US disclosed
US-20070148442-A1 Thermosetting resin composition, material for substrate and film for substrate SEKISUI CHEMICAL CO., LTD. (JP) 2007-06-28 US disclosed
US-20070072963-A1 Thermoplastic resin composition, material for substrate and film for substrate SEKISUI CHEMICAL CO., LTD. (JP) 2007-03-29 US disclosed
EP-1698670-A1 THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. (JP) 2006-09-06 EP disclosed
EP-1696003-A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. (JP) 2006-08-30 EP disclosed
US-3976824-A Treating agent useful for fibrous materials and preparation thereof ARAKAWA RINSAN KAGAKU KOGYO KABUSHIKI KAISHA (JA) 1976-08-24 US disclosed