SCHEMBL443630

SCHEMBL443630

CCCC1=C(C)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3944531 0.83
SCHEMBL914585 0.83
SCHEMBL8060140 0.71 HTR2C (0.31)
SCHEMBL21591825 0.70
SCHEMBL3941727 0.69 RXRA (0.32)
SCHEMBL15367238 0.67
SCHEMBL3945297 0.67 SCD (0.38)
SCHEMBL7589044 0.67 ALDH1A1 (0.30)
SCHEMBL22152373 0.66
SCHEMBL12616286 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2379639-B1 USE OF A FRICTION REDUCING AGENT BASF SE (DE) 2014-07-09 EP claimed
US-20120064790-A1 Ethylene Diphosphinic Acids CLARIANT FINANCE (BVI) LIMITED (VG) 2012-03-15 US disclosed
US-8084518-B2 Ethylenebis(hydroxyalkylphosphinic acid) and salts thereof CLARIANT FINANCE (BVI) LIMITED (VG) 2011-12-27 US disclosed
US-20100093239-A1 Ethylene Diphosphinic Acids CLARIANT INTERNATIONAL LTD. (CH) 2010-04-15 US disclosed
EP-1592664-A1 GRAFTABLE HINDERED AMINE LIGHT STABILIZERS Ciba SC Holding AG (CH) 2005-11-09 EP disclosed
US-20040214948-A1 Polyamide composition for molding HAYASHI RYUICHI (JP) 2004-10-28 US disclosed
WO-2004072035-A1 GRAFTABLE HINDERED AMINE LIGHT STABILIZERS CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 2004-08-26 WO disclosed
US-20030134980-A1 Polyamide composition for molding HAYASHI RYUICHI (JP) 2003-07-17 US disclosed
WO-2000024830-A9 POLYAMIDE COMPOSITION FOR MOLDING DU PONT (US) 2001-12-06 WO disclosed
EP-1137713-A1 POLYAMIDE COMPOSITION FOR MOLDING E.I. DU PONT DE NEMOURS AND COMPANY (US) 2001-10-04 EP disclosed
WO-2000024830-A1 POLYAMIDE COMPOSITION FOR MOLDING E.I. DU PONT DE NEMOURS AND COMPANY (US) 2000-05-04 WO disclosed