SCHEMBL4436550

SCHEMBL4436550

C=CCC1OC1CCC(=C)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 1/20 0.33
HSD17B10 Q99714 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11219707 0.83 MAPT (0.37)
SCHEMBL474934 0.73 TET2 (0.32)
SCHEMBL3259081 0.71 MAPT (0.33)
SCHEMBL3716678 0.71
SCHEMBL866014 0.68 KAT2A (0.36)
SCHEMBL2185811 0.66 THRB (0.43) ALOX15HSD17B10
SCHEMBL474791 0.66 THRB (0.43) ALOX15HSD17B10
SCHEMBL9206724 0.65
SCHEMBL7956502 0.65
SCHEMBL8520623 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9201299-B2 Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same SAN-EI KAGAKU CO., LTD. (JP) 2015-12-01 US disclosed
US-20130164679-A1 INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME SAN-EI KAGAKU CO., LTD. (JP) 2013-06-27 US disclosed
US-20090087775-A1 INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME SAN-EI KAGAKU CO., LTD. (JP) 2009-04-02 US disclosed