SCHEMBL866014

SCHEMBL866014

C=C(CCCC1OC1CCC)C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
KAT2A Q92830 2/20 0.36
HMGCR P04035 1/20 0.35
POLB P06746 1/20 0.33
FASN P49327 1/20 0.33
ALOX5 P09917 2/20 0.32
MAPT P10636 1/20 0.32
THRB P10828 1/20 0.31
FNTA P49354 1/20 0.31
FNTB P49356 1/20 0.31
PGGT1B P53609 1/20 0.31
TBXAS1 P24557 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL474791 0.86 THRB (0.43) POLBFASNTHRBFNTAFNTB
SCHEMBL2185811 0.86 THRB (0.43) POLBFASNTHRBFNTAFNTB
SCHEMBL15964149 0.77 ALDH1A1 (0.36) KAT2AHMGCRALOX5MAPT
SCHEMBL605053 0.75 TBXAS1 (0.36) POLBFASNTHRBFNTAFNTB
SCHEMBL22623 0.74
SCHEMBL6916130 0.74 CES1 (0.50) THRBFNTAFNTBPGGT1B
SCHEMBL11570612 0.73 AKR1B1 (0.54) HMGCRALOX5MAPT
SCHEMBL15964162 0.73 TSHR (0.50) POLBALOX5
Methacrylic Acid SCHEMBL27818071 0.73 POLB (0.46) HMGCRPOLBFASNALOX5THRB
SCHEMBL11576115 0.72 FFAR3 (0.46) KAT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
WO-2022255322-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
WO-2022255321-A1 INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
US-9788420-B2 Substrate and touch panel member using same TORAY INDUSTRIES, INC. (JP) 2017-10-10 US disclosed
US-9690197-B2 Negative-type photosensitive white composition for touch panel, touch panel and touch panel production method TORAY INDUSTRIES, INC. (JP) 2017-06-27 US disclosed
US-9510444-B2 2016-11-29 US disclosed
US-20160161847-A1 NEGATIVE-TYPE PHOTOSENSITIVE WHITE COMPOSITION FOR TOUCH PANEL, TOUCH PANEL AND TOUCH PANEL PRODUCTION METHOD TORAY INDUSTRIES, INC. (JP) 2016-06-09 US disclosed
US-20150366055-A1 SUBSTRATE AND TOUCH PANEL MEMBER USING SAME TORAY INDUSTRIES, INC. (JP) 2015-12-17 US disclosed
US-20150125680-A1 SUBSTRATE AND TOUCH PANEL MEMBER USING SAME TORAY INDUSTRIES, INC. (JP) 2015-05-07 US disclosed
US-8787723-B2 Resin composition for forming optical waveguide, resin film for forming optical waveguide, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-07-22 US disclosed
EP-2045629-B1 RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, RESIN FILM FOR OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE HITACHI CHEMICAL CO LTD (JP) 2013-09-04 EP disclosed
US-20120076468-A1 RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, RESIN FILM FOR FORMING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-29 US disclosed
US-8036511-B2 Resin composition for optical material, resin film for optical material, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-10-11 US disclosed
US-20110075981-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE MAKINO TATSUYA 2011-03-31 US disclosed
US-7853113-B2 Resin composition for optical material, resin film for optical material, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-12-14 US disclosed
US-20100221668-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE MAKINO TATSUYA 2010-09-02 US disclosed
US-7747129-B2 Resin composition for optical materials, resin film for optical material, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-06-29 US disclosed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US disclosed
US-20090196559-A1 Resin Composition for Optical Materials, Resin Film for Optical Material, and Optical Waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-08-06 US disclosed
EP-2045629-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE Hitachi Chemical Company, Ltd. (JP) 2009-04-08 EP disclosed