SCHEMBL444097

SCHEMBL444097

CC(C)c1nccn1CCC#N

nearest known ligand 0.54

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.54
KCNH2 Q12809 4/20 0.38
CSNK2A1 P68400 1/20 0.37
LMNA P02545 1/20 0.36
CYP2D6 P10635 1/20 0.36
TSHR P16473 1/20 0.36
CYP2C19 P33261 1/20 0.36
HIF1A Q16665 1/20 0.36
ALDH1A1 P00352 1/20 0.34
PDE4A P27815 1/20 0.33
PDE4B Q07343 1/20 0.33
PDE4C Q08493 1/20 0.33
PDE4D Q08499 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21051537 0.82 SMN1; SMN2 (0.49) SMN1; SMN2KCNH2CSNK2A1CYP2D6TSHR
SCHEMBL15014467 0.78 SMN1; SMN2 (0.60) SMN1; SMN2KCNH2CYP2D6TSHRCYP2C19
SCHEMBL3038968 0.77 SMN1; SMN2 (0.63) SMN1; SMN2KCNH2CYP2D6TSHRCYP2C19
SCHEMBL25857292 0.77 SMN1; SMN2 (0.58) SMN1; SMN2KCNH2CYP2D6TSHRCYP2C19
SCHEMBL27407439 0.77 SMN1; SMN2 (0.58) SMN1; SMN2KCNH2CYP2D6TSHRCYP2C19
SCHEMBL153672 0.77 ALDH1A1 (0.56) CSNK2A1LMNACYP2D6TSHRHIF1A
SCHEMBL15928087 0.77 SMN1; SMN2 (0.58) SMN1; SMN2KCNH2LMNACYP2D6TSHR
SCHEMBL21872285 0.76 SMN1; SMN2 (0.53) SMN1; SMN2KCNH2CYP2D6TSHRCYP2C19
SCHEMBL9253877 0.76 CSNK2A1 (0.42) CSNK2A1TSHRHIF1AALDH1A1PDE4A
SCHEMBL18394418 0.75 TLR8 (0.39) SMN1; SMN2CSNK2A1TSHRALDH1A1PDE4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 245 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180148600-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES MOMENTIVE PERFORMANCE MATERIALS INC. 2018-05-31 US claimed
US-9969878-B2 Polyalkylene carbonate resin composition having high thermal stability SK INNOVATION CO., LTD. (KR) 2018-05-15 US claimed
US-20160122535-A1 Polyalkylene Carbonate Resin Composition Having High Thermal Stability SK INNOVATION CO, LTD. (KR) 2016-05-05 US claimed
US-9309381-B2 Epoxy resin compositions using solvated solids AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-04-12 US claimed
EP-2746328-A1 Epoxy resin compositions using solvated solids AIR PRODUCTS AND CHEMICALS, INC. (US) 2014-06-25 EP claimed
US-20140171551-A1 Epoxy Resin Compositions Using Solvated Solids AIR PRODUCTS AND CHEMICALS INC. (US) 2014-06-19 US claimed
EP-2723793-A1 EPOXY RESIN COMPOSITIONS Air Products and Chemicals, Inc. (US) 2014-04-30 EP claimed
WO-2012174989-A1 EPOXY RESIN COMPOSITIONS AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-12-27 WO claimed
US-20120328811-A1 Epoxy Resin Compositions AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-12-27 US claimed
EP-0642416-B1 FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION LOCTITE CORP (US) 2003-10-01 EP claimed
EP-0867480-A2 Cationically electrodepositable coating composition KANSAI PAINT CO., LTD. (JP) 1998-09-30 EP claimed
EP-0554817-B1 Epoxy resin composition and cured product thereof MITSUBISHI CHEM CORP (JP) 1998-08-19 EP claimed
US-5322864-A Low viscosity epoxy resin, liquid curing agent, metal powder MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1994-06-21 US claimed
EP-0554817-A1 Epoxy resin composition and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 1993-08-11 EP claimed
US-20260060129-A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MANUFACTURING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-02-26 US disclosed
US-20250361425-A1 BRITTLE ADHESIVE SHEET AND BRITTLE ADHESIVE SHEET PRODUCTION METHOD LINTEC CORP (JP) 2025-11-27 US disclosed
US-20250293202-A1 RESIN COMPOSITION AND METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH UNDERFILL USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-09-18 US disclosed
EP-0554817-A1 Epoxy resin composition and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 1993-08-11 EP disclosed
US-4401499-A LAMINATION SUMITOMO BAKELITE COMPANY LIMITED (JP) 1983-08-30 US disclosed
US-4107098-A HALOMETHYOXIRANE IS REACTED WITH AN IMIDAZOLE COMPOUND-PRODUCT REACTED WITH POLYFUNCTIONAL EPOXY COMPOUND MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1978-08-15 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260060129-A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MANUFACTURING THE SAME PIK3C3, TES, PRKX SMN1; SMN2 2713/4885KCNH2 353/4885CSNK2A1 2038/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.