SCHEMBL4451694

SCHEMBL4451694

COC(OC)[SiH](N)CCC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2927552 0.70
SCHEMBL17765087 0.69
SCHEMBL1547788 0.67
SCHEMBL4770427 0.64
SCHEMBL8466997 0.64
SCHEMBL8849112 0.60
SCHEMBL28732546 0.60 CYP2D6 (0.35)
SCHEMBL1325484 0.57
SCHEMBL18523648 0.57
SCHEMBL15433072 0.57 RIPK1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102482514-B Adhesion promoter for coatings on surfaces of different substrates BYK-CHEMIE GMBH (DE) 2015-09-23 CN disclosed
US-20140024795-A1 ALIPHATIC POLYCARBONATE POLYOLS CONTAINING SILYL GROUPS NOVOMER, INC. (US) 2014-01-23 US disclosed
WO-2013163442-A1 ALIPHATIC POLYCARBONATE POLYOLS CONTAINING SILYL GROUPS NOVOMER, INC. (US) 2013-10-31 WO disclosed
US-8216698-B2 Organic electroluminescence device, novel platinum complex compound and novel compound capable of being a ligand thereof FUJIFILM CORPORATION (JP) 2012-07-10 US disclosed
EP-2094618-A1 LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION Sika Technology AG (CH) 2009-09-02 EP disclosed
WO-2008061981-A1 LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION SIKA TECHNOLOGY AG (CH) 2008-05-29 WO disclosed