SCHEMBL4453752

SCHEMBL4453752

CCC=C[SiH](OC(C)=O)OC(C)=O

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
LMNA P02545 1/20 0.33
HSD17B10 Q99714 1/20 0.33
GLO1 Q04760 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1493149 0.77
SCHEMBL19858495 0.74 ALDH1A1 (0.36) ALDH1A1LMNAHSD17B10GLO1
SCHEMBL1276340 0.73 ALDH1A1 (0.32) ALDH1A1
SCHEMBL3447701 0.72
SCHEMBL19858485 0.70 ALDH1A1 (0.35) ALDH1A1
SCHEMBL28419082 0.68 TRPA1 (0.33) ALDH1A1HSD17B10
SCHEMBL4446381 0.67
SCHEMBL1270676 0.65
SCHEMBL2950746 0.65 ALDH1A1 (0.38) ALDH1A1HSD17B10
SCHEMBL9082813 0.65 ALDH1A1 (0.33) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3916056-B1 HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME SHINETSU CHEMICAL CO (JP) 2023-12-13 EP disclosed
CN-112236482-B Heat-conductive silicone composition and method for producing same 信越化学工业株式会社 2022-12-27 CN disclosed
US-20210403785-A1 HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-12-30 US disclosed
EP-3916056-A1 HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-12-01 EP disclosed
CN-113330074-A Highly thermally conductive silicone composition and method for producing same 信越化学工业株式会社 2021-08-31 CN disclosed
US-20210253927-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-08-19 US disclosed
EP-3805317-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-04-14 EP disclosed
CN-112236482-A Heat-conductive silicone composition and method for producing same 信越化学工业株式会社 2021-01-15 CN disclosed
EP-1893692-B1 SILICONE RUBBER COMPOSITION DOW CORNING TORAY CO LTD (JP) 2014-05-07 EP disclosed
US-20090312475-A1 Silicone Rubber Composition DOW CORNING TORAY COMPANY, LTD. (JP) 2009-12-17 US disclosed
EP-1903087-B1 Two part adhesive for silicone rubber which cures by addition reaction SHINETSU CHEMICAL CO (JP) 2008-12-31 EP disclosed
US-20080081863-A1 Two part adhesive for silicone rubber which cures by addition reaction SHIN-ETSU CHEMICAL CO., LTD. 2008-04-03 US disclosed
EP-1903087-A1 Two part adhesive for silicone rubber which cures by addition reaction Shin-Etsu Chemical Co., Ltd. (JP) 2008-03-26 EP disclosed
EP-1893692-A2 SILICONE RUBBER COMPOSITION Dow Corning Toray Co., Ltd. (JP) 2008-03-05 EP disclosed
WO-2006129887-A2 SILICONE RUBBER COMPOSITION DOW CORNING TORAY CO., LTD. (JP) 2006-12-07 WO disclosed
EP-1342742-B1 Room temperature curable polysiloxane compositions HANSE CHEMIE AG (DE) 2006-08-02 EP disclosed
EP-1342742-A1 Room temperature curable polysiloxane compositions hanse chemie AG (DE) 2003-09-10 EP disclosed