⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28829386 | 0.89 | L3MBTL1 (0.31) | — | |
| SCHEMBL4455263 | 0.84 | SHBG (0.30) | — | |
| SCHEMBL7003852 | 0.79 | — | — | |
| SCHEMBL17562129 | 0.78 | PIK3CD (0.31) | — | |
| SCHEMBL20422044 | 0.78 | — | — | |
| SCHEMBL432325 | 0.73 | — | — | |
| SCHEMBL12681447 | 0.72 | EBP (0.34) | — | |
| SCHEMBL188313 | 0.72 | PPM1B (0.30) | — | |
| SCHEMBL4597246 | 0.71 | SHBG (0.32) | — | |
| SCHEMBL12310821 | 0.71 | SHBG (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240166798-A1 | EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2024-05-23 | — | — | US | disclosed |
| US-20210122892-A1 | PREPREG AND PRODUCTION METHOD THEREFOR, SLIT TAPE PREPREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2021-04-29 | — | — | US | disclosed |
| EP-3797991-A1 | PREPREG AND PRODUCTION METHOD THEREFOR, SLIT TAPE PREPREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL | Toray Industries, Inc. (JP) | 2021-03-31 | — | — | EP | disclosed |
| CN-112313078-A | Prepreg, method for producing prepreg, slit tape prepreg, and carbon fiber-reinforced composite material | 东丽株式会社 | 2021-02-02 | — | — | CN | disclosed |
| US-20090131609-A1 | Episulfide Group-Substituted Silicon Compound and Thermosetting Resin Composition Containing Same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-05-21 | — | — | US | disclosed |
| US-7381784-B2 | Epoxy group-containing silicon compound and thermosetting resin composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2008-06-03 | — | — | US | disclosed |
| US-20080076900-A1 | Epoxy Resin Composition for Optical Semiconductor Encapsulation | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2008-03-27 | — | — | US | disclosed |
| EP-1795550-A1 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ENCAPSULATION | Nippon Kayaku Kabushiki Kaisha (JP) | 2007-06-13 | — | — | EP | disclosed |
| US-20060135723-A1 | Silicon compound containing epoxy group and thermosetting resin composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2006-06-22 | — | — | US | disclosed |
| EP-1593703-A1 | SILICON COMPOUND CONTAINING EPOXY GROUP AND THERMOSETTING RESIN COMPOSITION | Nippon Kayaku Kabushiki Kaisha (JP) | 2005-11-09 | — | — | EP | disclosed |