SCHEMBL446489

SCHEMBL446489

CCO[Si](OCC)(OCC)c1ccc(C(F)(F)F)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 1/20 0.41
NR1H2 P55055 2/20 0.41
NR1H3 Q13133 2/20 0.41
MAPK1 P28482 1/20 0.40
IDO1 P14902 2/20 0.39
KIF11 P52732 4/20 0.39
NPSR1 Q6W5P4 1/20 0.37
TAAR1 Q96RJ0 1/20 0.36
MAPT P10636 2/20 0.36
KDM4E B2RXH2 1/20 0.36
MEN1 O00255 1/20 0.36
HSP90AA1 P07900 1/20 0.36
CRHBP P24387 1/20 0.36
KMT2A Q03164 1/20 0.36
CRHR2 Q13324 1/20 0.36
HEXA P06865 1/20 0.36
HEXB P07686 1/20 0.36
ALDH1A1 P00352 1/20 0.36
TSHR P16473 1/20 0.36
POLB P06746 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15735163 0.94 KIF11 (0.48) HPGDNR1H2NR1H3KIF11MAPT
SCHEMBL15738099 0.90 HPGD (0.39) HPGDNR1H2NR1H3MAPK1IDO1
SCHEMBL15736462 0.90 HPGD (0.39) HPGDNR1H2NR1H3MAPK1IDO1
SCHEMBL15736073 0.86 KIF11 (0.44) HPGDKIF11MAPTKDM4EMEN1
SCHEMBL15737478 0.86 KIF11 (0.44) HPGDKIF11MAPTKDM4EMEN1
SCHEMBL20478197 0.84 NQO1 (0.35)
SCHEMBL50701 0.84 NQO1 (0.35)
SCHEMBL15736102 0.84 NR1H2 (0.39) NR1H2NR1H3IDO1KIF11TAAR1
SCHEMBL4528959 0.84 HPGD (0.33) HPGDNR1H2NR1H3MAPK1IDO1
SCHEMBL28642449 0.83 TSHR (0.39) HPGDNR1H2NR1H3MAPK1KIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 174 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119461388-A Preparation method and application of fluorosilane modified silica aerogel 天津大学 2025-02-18 CN claimed
CN-119371921-A High-light-transmittance yellowing-resistant epoxy adhesive film and preparation method thereof 青岛德聚胶接技术有限公司 2025-01-28 CN claimed
CN-119331499-A Solvent-free paint and preparation method thereof 深圳市德固新材料科技有限公司 2025-01-21 CN claimed
CN-117683346-B Low-water-absorption glass fiber reinforced PA/PPO alloy and preparation method thereof 上海聚威新材料股份有限公司 2024-05-03 CN claimed
CN-117683346-A Low-water-absorption glass fiber reinforced PA/PPO alloy and preparation method thereof 上海聚威新材料股份有限公司 2024-03-12 CN claimed
CN-106752837-B Composite anticorrosive liquid for steel surface and preparation method thereof 华南农业大学 2020-03-17 CN claimed
EP-2861650-B1 POLYIMIDE RESIN AND POLYIMIDE FILM PRODUCED THEREFROM KOLON INC (KR) 2019-03-20 EP claimed
EP-2398734-B1 ASSEMBLY OF MAGNETICALLY TUNABLE PHOTONIC CRYSTALS IN NONPOLAR SOLVENTS UNIV CALIFORNIA (US) 2018-07-18 EP claimed
EP-3162861-B1 METHOD FOR MANUFACTURING FLUORINE-BASED RESIN COATING POWDER AND ELECTRODE MATERIAL HYUNDAI MOTOR CO LTD (KR) 2018-06-13 EP claimed
EP-3162861-A1 METHOD FOR MANUFACTURING FLUORINE-BASED RESIN COATING POWDER AND ELECTRODE MATERIAL Hyundai Motor Company (KR) 2017-05-03 EP claimed
US-20170114227-A1 METHOD FOR MANUFACTURING FLUORINE-BASED RESIN COATING POWDER AND ELECTRODE MATERIAL HYUNDAI MOTOR COMPANY (KR) 2017-04-27 US claimed
US-20160096952-A1 POLYIMIDE RESIN AND POLYIMIDE FILM PRODUCED THEREFROM KOLON INDUSTRIES, INC. (KR) 2016-04-07 US claimed
EP-2861650-A1 POLYIMIDE RESIN AND POLYIMIDE FILM PRODUCED THEREFROM Kolon Industries, Inc. (KR) 2015-04-22 EP claimed
US-20120061609-A1 ASSEMBLY OF MAGNETICALLY TUNABLE PHOTONIC CRYSTALS IN NONPOLAR SOLVENTS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2012-03-15 US claimed
WO-2010096203-A2 ASSEMBLY OF MAGNETICALLY TUNABLE PHOTONIC CRYSTALS IN NONPOLAR SOLVENTS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2010-08-26 WO claimed
CN-119461388-A Preparation method and application of fluorosilane modified silica aerogel 天津大学 2025-02-18 CN disclosed
CN-119371921-A High-light-transmittance yellowing-resistant epoxy adhesive film and preparation method thereof 青岛德聚胶接技术有限公司 2025-01-28 CN disclosed
US-20040143082-A1 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed
CN-1505651-A Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR��ʽ���� 2004-06-16 CN disclosed
EP-1398339-A1 POLYSILOXANE, PROCESS FOR PRODUCTION THEREOF AND RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-03-17 EP disclosed