SCHEMBL44855

SCHEMBL44855

CC(C)(C)C(OC(c1ccco1)C(C)(C)C)c1ccco1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 6/20 0.36
KMT2A Q03164 5/20 0.36
PKM P14618 1/20 0.36
PTPN1 P18031 1/20 0.36
PTPN7 P35236 1/20 0.36
BLM P54132 1/20 0.36
ESR2 Q92731 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
TP53 P04637 1/20 0.36
ALDH1A1 P00352 6/20 0.35
MAPT P10636 4/20 0.35
MEN1 O00255 4/20 0.35
KDM4E B2RXH2 3/20 0.35
TDP1 Q9NUW8 1/20 0.35
ALOX5 P09917 1/20 0.34
HSD17B10 Q99714 3/20 0.33
HPGD P15428 3/20 0.33
AGTR1 P30556 1/20 0.33
MAPK1 P28482 1/20 0.33
APAF1 O14727 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1262626 0.80 KMT2A (0.32) POLBKMT2APKMPTPN1PTPN7
SCHEMBL19419087 0.75 KMT2A (0.40) POLBKMT2APKMPTPN1PTPN7
SCHEMBL12626508 0.73 ALOX5 (0.40) POLBKMT2APKMPTPN1PTPN7
SCHEMBL12705970 0.73 ALOX5 (0.40) POLBKMT2APKMPTPN1PTPN7
SCHEMBL12779618 0.72 ALOX5 (0.42) POLBKMT2APKMPTPN1PTPN7
SCHEMBL14453316 0.71 ALOX5 (0.39) POLBKMT2APKMPTPN1PTPN7
SCHEMBL20721295 0.71 ALOX5 (0.39) POLBKMT2APKMPTPN1PTPN7
SCHEMBL1925252 0.71 KMT2A (0.47) POLBKMT2APKMPTPN1PTPN7
SCHEMBL12569545 0.71 ALOX5 (0.39) POLBKMT2APKMPTPN1PTPN7
SCHEMBL9296215 0.71 ALDH1A1 (0.40) POLBKMT2APKMPTPN1PTPN7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9659771-B2 Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning APPLIED MATERIALS, INC. (US) 2017-05-23 US claimed
US-20160365248-A1 CONFORMAL STRIPPABLE CARBON FILM FOR LINE-EDGE-ROUGHNESS REDUCTION FOR ADVANCED PATTERNING APPLIED MATERIALS, INC. 2016-12-15 US claimed
WO-2011146212-A2 ULTRA HIGH SELECTIVITY ASHABLE HARD MASK FILM APPLIED MATERIALS, INC. (US) 2011-11-24 WO claimed
US-20110287633-A1 ULTRA HIGH SELECTIVITY ASHABLE HARD MASK FILM APPLIED MATERIALS, INC. (US) 2011-11-24 US claimed
CN-101407909-A Methods for high temperature deposition of an amorphous carbon layer APPLIED MATERIALS INC (US) 2009-04-15 CN claimed
US-20090093128-A1 METHODS FOR HIGH TEMPERATURE DEPOSITION OF AN AMORPHOUS CARBON LAYER APPLIED MATERIALS, INC. 2009-04-09 US claimed
US-7399697-B2 Very low dielectric constant plasma-enhanced CVD films APPLIED MATERIALS, INC. (US) 2008-07-15 US claimed
US-20070275569-A1 METHODS AND APPARATUS FOR E-BEAM TREATMENT USED TO FABRICATE INTEGRATED CIRCUIT DEVICES APPLIED MATERIALS, INC. 2007-11-29 US claimed
US-6914014-B2 Method for curing low dielectric constant film using direct current bias APPLIED MATERIALS, INC. (US) 2005-07-05 US claimed
US-20050136240-A1 Very low dielectric constant plasma-enhanced CVD films MANDAL ROBERT P (US) 2005-06-23 US claimed
US-6797643-B2 Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power APPLIED MATERIALS INC. 2004-09-28 US claimed
WO-2004063422-A2 METHOD FOR CURING LOW DIELECTRIC CONSTANT FILM USING DIRECT CURRENT BIAS APPLIED MATERIALS, INC. (US) 2004-07-29 WO claimed
US-20040137758-A1 METHOD FOR CURING LOW DIELECTRIC CONSTANT FILM USING DIRECT CURRENT BIAS APPLIED MATERIALS,INC. 2004-07-15 US claimed
US-20040101632-A1 Method for curing low dielectric constant film by electron beam APPLIED MATERIALS, INC. 2004-05-27 US claimed
US-20040082193-A1 PLASMA ENHANCED CVD LOW K CARBON-DOPED SILICON OXIDE FILM DEPOSITION USING VHF-RF POWER APPLIED MATERIALS, INC 2004-04-29 US claimed
US-20030232495-A1 Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices APPLIED MATERIALS, INC. 2003-12-18 US claimed
US-20030194495-A1 Crosslink cyclo-siloxane compound with linear bridging group to form ultra low k dielectric APPLIED MATERIALS, INC. 2003-10-16 US claimed
US-20030194496-A1 Methods for depositing dielectric material APPLIED MATERIALS, INC. 2003-10-16 US claimed
US-20030186000-A1 Hardness improvement of silicon carboxy films APPLIED MATERIALS, INC. 2003-10-02 US claimed
US-20020142585-A1 Very low dielectric constant plasma-enhanced CVD films APPLIED MATERIALS, INC. 2002-10-03 US claimed