Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.40 |
| ▸ | CA2 | P00918 | 2/20 | 0.40 |
| ▸ | CA7 | P43166 | 1/20 | 0.40 |
| ▸ | CA9 | Q16790 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | SMPD1 | P17405 | 3/20 | 0.31 |
| ▸ | LPAR2 | Q9HBW0 | 1/20 | 0.31 |
| ▸ | LPAR3 | Q9UBY5 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22343516 | 0.93 | CA1 (0.36) | CA1CA2CA7CA9TDP1 | |
| SCHEMBL30118276 | 0.81 | CA1 (0.37) | CA1CA2CA7CA9TDP1 | |
| SCHEMBL28911608 | 0.81 | CA1 (0.37) | CA1CA2CA7CA9TDP1 | |
| SCHEMBL3718698 | 0.80 | SMPD1 (0.33) | SMPD1LPAR3 | |
| SCHEMBL9306345 | 0.78 | SMPD1 (0.35) | SMPD1LPAR2LPAR3 | |
| Phosphoric Acid SCHEMBL1074271 | 0.77 | CA1 (0.47) | CA1CA2CA7CA9TDP1 | |
| SCHEMBL2525977 | 0.76 | CA1 (0.39) | CA1CA2CA7CA9SMPD1 | |
| SCHEMBL170149 | 0.76 | CA1 (0.39) | CA1CA2CA7CA9SMPD1 | |
| SCHEMBL21291938 | 0.76 | SMPD1 (0.38) | TDP1SMPD1LPAR2LPAR3 | |
| SCHEMBL958656 | 0.75 | LPAR3 (0.40) | CA1CA2CA7CA9LPAR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240240073-A1 | THERMAL INSULATING FLUIDS | OMNOVA SOLUTIONS, INC. (US) | 2024-07-18 | — | — | US | disclosed |
| WO-2024117198-A1 | BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, SLURRY COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, NON-AQUEOUS SECONDARY BATTERY ELECTRODE, AND NON-AQUEOUS SECONDARY BATTERY | 日本ゼオン株式会社 | 2024-06-06 | — | — | WO | disclosed |
| US-20240118609-A1 | RESIN COMPOSITION FOR SOLDER RESIST, SOLDER RESIST FILM, AND CIRCUIT BOARD | SEKISUI KASEI CO., LTD. (JP) | 2024-04-11 | — | — | US | disclosed |
| US-20240059810-A1 | HOLLOW RESIN PARTICLES USED IN RESIN COMPOSITION FOR SEMICONDUCTOR MEMBER | SEKISUI KASEI CO., LTD. (JP) | 2024-02-22 | — | — | US | disclosed |
| US-20240055308-A1 | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING, UNDERFILL MATERIAL, MOLD RESIN, AND SEMICONDUCTOR PACKAGE | SEKISUI KASEI CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| US-20240057252-A1 | LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AND CIRCUIT BOARD | SEKISUI KASEI CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| WO-2024024913-A1 | BINDER COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ELECTRODE, SLURRY COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ELECTRODE, ELECTRODE FOR NONAQUEOUS SECONDARY BATTERY, AND NONAQUEOUS SECONDARY BATTERY | 日本ゼオン株式会社 | 2024-02-01 | — | — | WO | disclosed |
| WO-2024024912-A1 | BINDER COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ELECTRODES, SLURRY COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ELECTRODES, ELECTRODE FOR NONAQUEOUS SECONDARY BATTERIES, AND NONAQUEOUS SECONDARY BATTERY | 日本ゼオン株式会社 | 2024-02-01 | — | — | WO | disclosed |
| US-11850772-B2 | Laminate production method | ZEON CORPORATION (JP) | 2023-12-26 | — | — | US | disclosed |
| US-11827790-B2 | Polymer latex and layered product | ZEON CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| EP-2518014-A1 | CARBON MICROPARTICLE AND PROCESS FOR PRODUCTION THEREOF | Toray Industries, Inc. (JP) | 2012-10-31 | — | — | EP | disclosed |
| CN-102666376-A | Carbon microparticle and process for production thereof | TORAY INDUSTRIES | 2012-09-12 | — | — | CN | disclosed |
| CN-101652884-A | Binder for secondary battery electrode, secondary battery electrode, and secondary battery | ZEON CORP JP | 2010-02-17 | — | — | CN | disclosed |
| CN-100586995-C | Composition for dip molding and dip molded article | ZEON CORP | 2010-02-03 | — | — | CN | disclosed |
| CN-100467520-C | Dip forming composition and dip formed article | ZEON CORP (JP) | 2009-03-11 | — | — | CN | disclosed |
| US-20090053603-A1 | Binder for Electrode of Non-Aqueous Electrolyte Secondary Battery, Electrode, and Non-Aqueous Electrolyte Secondary Battery | ZEON CORPORATION (JP) | 2009-02-26 | — | — | US | disclosed |
| CN-101065436-A | Composition for dip forming and dip-formed molding | ZEON CORP (JP) | 2007-10-31 | — | — | CN | disclosed |
| CN-1882653-A | Dip forming composition and dip formed article | ZEON CORP (JP) | 2006-12-20 | — | — | CN | disclosed |
| US-5151330-A | Multilayer element with acid modified vinyl chloride binder with polycaprolactoneurethanes | KONICA CORPORATION (JP) | 1992-09-29 | — | — | US | disclosed |
| EP-0385715-A2 | Magnetic recording medium | NIPPON ZEON CO., LTD. (JP) | 1990-09-05 | — | — | EP | disclosed |