SCHEMBL4500685

SCHEMBL4500685

Cc1ccc(C(c2cccc(Cl)c2)=[Zr](C2=CC=CC2)C2c3ccc(C(C)(C)C)cc3-c3cc(C(C)(C)C)ccc32)cc1

nearest known ligand 0.31

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
RAPGEF3 O95398 1/20 0.31
RAPGEF4 Q8WZA2 1/20 0.31
MAPT P10636 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
PPARG P37231 1/20 0.30
NR1H4 Q96RI1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14735686 0.94 RAPGEF3 (0.31) RAPGEF3RAPGEF4MAPTSMN1; SMN2
Hydrochloric Acid SCHEMBL811254 0.93 RAPGEF3 (0.31) RAPGEF3RAPGEF4SMN1; SMN2PPARGNR1H4
SCHEMBL2861724 0.91 NPC1 (0.32) MAPT
Hydrochloric Acid SCHEMBL812125 0.90 NPC1 (0.32) MAPT
SCHEMBL3835192 0.90 MEN1 (0.30)
SCHEMBL3835613 0.88 POLB (0.34) SMN1; SMN2PPARGNR1H4
Hydrochloric Acid SCHEMBL811226 0.87 POLB (0.33) SMN1; SMN2
SCHEMBL14735651 0.87
Hydrochloric Acid SCHEMBL811878 0.86 KIF11 (0.31) RAPGEF3RAPGEF4SMN1; SMN2PPARGNR1H4
Hydrochloric Acid SCHEMBL813267 0.86 KCNK3 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4011963-B1 POLYPROPYLENE RESIN COMPOSITION AND MONOLAYER AND MULTILAYER FILM MITSUI CHEMICALS INC (JP) 2024-03-13 EP disclosed
EP-2080784-B1 PROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING PROPYLENE RESIN COMPOSITION, PROPYLENE POLYMER COMPOSITION, MOLDED BODY MADE OF THE PROPYLENE RESIN COMPOSITION, AND ELECTRIC WIRE MITSUI CHEMICALS INC (JP) 2013-03-06 EP disclosed
EP-2085420-A1 POLYPROPYLENE RESIN FILM AND USE THEREOF Mitsui Chemicals, Inc. (JP) 2009-08-05 EP disclosed