SCHEMBL4529908

SCHEMBL4529908

CC(=CC(C)(C)C)C(=O)ON

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
GRIK1 P39086 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28469229 0.78
SCHEMBL11032462 0.78 ALDH1A1 (0.40)
SCHEMBL2100268 0.78
SCHEMBL2100271 0.78
SCHEMBL26498808 0.76 DGAT1 (0.33)
SCHEMBL21296283 0.76
SCHEMBL11048888 0.76
SCHEMBL28027891 0.76 DGAT1 (0.33)
SCHEMBL2214381 0.74
Hydrochloric Acid SCHEMBL11324556 0.74 GRIK1 (0.31) GRIK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070269747-A1 Lithography Technique Using Silicone Molds DOW CORNING CORPORATION 2007-11-22 US claimed
EP-1803033-A2 LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS Dow Corning Corporation (US) 2007-07-04 EP claimed
WO-2006031455-A2 LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS DOW CORNING CORPORATION (US) 2006-03-23 WO claimed
US-20090102089-A1 Epoxy Formulations for Use in Lithography Techniques DOW CORNING CORPORATION 2009-04-23 US disclosed
EP-1976900-A1 EPOXY FORMULATIONS FOR USE IN LITHOGRAPHY TECHNIQUES Dow Corning Corporation (US) 2008-10-08 EP disclosed
US-20070269747-A1 Lithography Technique Using Silicone Molds DOW CORNING CORPORATION 2007-11-22 US disclosed
WO-2007087399-A1 EPOXY FORMULATIONS FOR USE IN LITHOGRAPHY TECHNIQUES DOW CORNING CORPORATION (US) 2007-08-02 WO disclosed
EP-1803033-A2 LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS Dow Corning Corporation (US) 2007-07-04 EP disclosed
WO-2006031455-A2 LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS DOW CORNING CORPORATION (US) 2006-03-23 WO disclosed