SCHEMBL453512

SCHEMBL453512

CC(C)(C)c1ccc(-c2cc(P(O)O)c3c(c2-c2ccc(C(C)(C)C)cc2C(C)(C)C)-c2ccccc2-3)c(C(C)(C)C)c1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.39
NPC1 O15118 1/20 0.39
PLA2G1B P04054 1/20 0.39
NFKB1 P19838 1/20 0.39
CASP3 P42574 1/20 0.39
RAB9A P51151 1/20 0.39
NFKB2 Q00653 1/20 0.39
RELA Q04206 1/20 0.39
SENP8 Q96LD8 1/20 0.39
SENP7 Q9BQF6 1/20 0.39
SENP6 Q9GZR1 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
ATG4B Q9Y4P1 1/20 0.39
DNMT1 P26358 3/20 0.32
KIF11 P52732 1/20 0.31
APEX1 P27695 1/20 0.31
HPGD P15428 1/20 0.30
ALOX15 P16050 1/20 0.30
HSD17B10 Q99714 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6064231 0.85 ALDH1A1 (0.40) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL12803214 0.84 ALDH1A1 (0.44) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL1903605 0.84 NPC1 (0.46) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL228138 0.82 ALDH1A1 (0.53) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL2291480 0.82 ALDH1A1 (0.40) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL3031172 0.82 ALDH1A1 (0.38) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL30285371 0.81 ALDH1A1 (0.44) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL29459528 0.81 NPC1 (0.36) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL8378516 0.81 NPC1 (0.36) ALDH1A1NPC1PLA2G1BNFKB1CASP3
SCHEMBL1902888 0.81 ALDH1A1 (0.49) ALDH1A1NPC1PLA2G1BNFKB1CASP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 433 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4157905-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY Blue Cube IP LLC (US) 2023-04-05 EP claimed
US-20100119835-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN INTERNATIONAL LLC (US) 2010-05-13 US claimed
EP-2118197-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES Huntsman Advanced Materials (Switzerland) GmbH (CH) 2009-11-18 EP claimed
WO-2008110512-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2008-09-18 WO claimed
EP-4743503-A1 DUAL CURABLE OLIGOMERS ARKEMA France (FR) 2026-05-20 EP disclosed
EP-3433086-B1 ENERGETIC MATERIALS TNO (NL) 2026-05-06 EP disclosed
EP-4722199-A1 AZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID AZOLE COMPOUND, AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2026-04-08 EP disclosed
EP-3787878-B1 METHODS OF POST-PROCESSING PHOTOFABRICATED ARTICLES CREATED VIA ADDITIVE FABRICATION STRATASYS INC (US) 2026-02-18 EP disclosed
US-12516000-B2 Energetic materials NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO (NL) 2026-01-06 US disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
US-20250370407-A1 PHOTOSENSITIVE COMPOSITION, HOLOGRAM RECORDING MEDIUM, HOLOGRAM OPTICAL ELEMENT, OPTICAL DEVICE, AND ELECTRONIC DEVICE SONY GROUP CORP (JP) 2025-12-04 US disclosed
EP-4642770-A1 TRIARYLSULFONIUM BASED PHOTOINITIATORS FOR LED CURE OF CATIONIC, FREE RADICAL AND HYBRID CATIONIC/FREE RADICAL FORMULATIONS ARKEMA France (FR) 2025-11-05 EP disclosed
US-20030004256-A1 Vibration- damping thermoplastic resin composition and molded article therefrom TEIJIN CHEMICALS LTD. (JP) 2003-01-02 US disclosed
US-20020132872-A1 Resin composition for photofabrication of three dimensional objects DSM IP ASSETS B.V. (NL) 2002-09-19 US disclosed
US-6362269-B1 BLEND OF AROMATIC POLYCARBONATE AND STYRENE POLYMER OR AROMATIC POLYESTER TEIJIN CHEMICALS, LTD. (JP) 2002-03-26 US disclosed
EP-1158024-A1 DAMPING THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLES Teijin Chemicals, Ltd. (JP) 2001-11-28 EP disclosed
US-20010044004-A1 Optical recording medium SONY CORPORATION (JP) 2001-11-22 US disclosed
EP-1130587-A2 Optical recording medium SONY CORPORATION (JP) 2001-09-05 EP disclosed
EP-1038920-A1 RESIN COMPOSITION Teijin Chemicals, Ltd. (JP) 2000-09-27 EP disclosed
WO-2000049080-A1 PHOTO CURABLE LIQUID RESIN COMPOSITION AND PHOTOFABRICATED CURED PRODUCT DSM N.V. (NL) 2000-08-24 WO disclosed