SCHEMBL45400

SCHEMBL45400

FCCCCCC(F)C(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28783839 1.00
SCHEMBL1697639 1.00
SCHEMBL45381 0.97
SCHEMBL4442351 0.88
SCHEMBL25235511 0.83
SCHEMBL45269 0.83
SCHEMBL45378 0.83
SCHEMBL22042309 0.83
SCHEMBL45231 0.81
SCHEMBL12468957 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101573316-B Process for separating fluoroolefins from HF by liquid-liquid extraction DU PONT 2013-12-25 CN claimed
US-20250286143-A1 ELECTROLYTE SOLVENT FOR BATTERIES APPLE INC. 2025-09-11 US disclosed
CN-107667415-B Conformal peelable carbon films for advanced patterning with reduced line edge roughness 应用材料公司 2021-10-26 CN disclosed
CN-110325911-A Photosensitive polymer combination, precursor containing heterocycle polymer, cured film, laminated body, the manufacturing method of cured film and semiconductor devices 富士胶片株式会社 2019-10-11 CN disclosed
CN-106133602-B Photosensitive polymer combination, cured film, the manufacturing method of cured film and semiconductor devices 富士胶片株式会社 2019-10-08 CN disclosed
CN-108136756-B Laminated body, the manufacturing method of laminated body, the manufacturing method of semiconductor devices and semiconductor devices 富士胶片株式会社 2019-08-23 CN disclosed
CN-110050036-A The manufacturing method of composition, bonding agent, sintered body, conjugant and conjugant 日立化成株式会社 2019-07-23 CN disclosed
CN-110050040-A The manufacturing method of composition, bonding agent, sintered body, conjugant and conjugant 日立化成株式会社 2019-07-23 CN disclosed
CN-110050033-A COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD FOR PRODUCING JOINED BODY 日立化成株式会社 2019-07-23 CN disclosed
CN-110050047-A Manufacturing method, Transient liquid phase sintering composition, sintered body and the conjugant of conjugant 日立化成株式会社 2019-07-23 CN disclosed
WO-2005087974-A2 CVD PROCESSES FOR THE DEPOSITION OF AMORPHOUS CARBON FILMS APPLIED MATERIALS, INC. (US) 2005-09-22 WO disclosed
CN-1608219-A Polymer optical waveguide film HITACHI CHEMICAL CO LTD (JP) 2005-04-20 CN disclosed
CN-1513122-A Optical element, method for manufacturing optical element, coating device, and coating method �������ɹ�ҵ��ʽ���� 2004-07-14 CN disclosed
CN-1513128-A Electrode structure �������ɹ�ҵ��ʽ���� 2004-07-14 CN disclosed
CN-1119678-C Polyimides and optical parts obtained by using the same HITACHI CHEMICAL CO LTD (JP) 2003-08-27 CN disclosed
CN-1427022-A Poly-imide precursor, its preparing process and resin composition using same KANEGAFUCHI CHEMICAL IND (JP) 2003-07-02 CN disclosed
CN-1379009-A Monomer containing electron drawing group and electron donating group and polymer and proton conductive membrane containing same JSR CORP (JP) 2002-11-13 CN disclosed
CN-1147640-A Polyimides and optical parts obtained by using the same HITACHI CHEMICAL CO LTD (JP) 1997-04-16 CN disclosed
US-4910041-A Generated arced plasma; applying a magnetic field JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-03-20 US disclosed
US-4693799-A LOW TEMPERATURE PULSE DISCHARGING JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-09-15 US disclosed