SCHEMBL4560606

SCHEMBL4560606

C=CS(=O)(=O)C(CCCC(C(N)=O)S(=O)(=O)C=C)C(N)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1708007 0.91 TSHR (0.32)
Ethane SCHEMBL9562352 0.88
SCHEMBL5583108 0.84 CA1 (0.34)
SCHEMBL10536537 0.83 ALDH1A1 (0.32)
SCHEMBL4579557 0.79 CA1 (0.32)
SCHEMBL8480192 0.76
SCHEMBL6045482 0.71
SCHEMBL7936917 0.70
SCHEMBL8380103 0.67 TSHR (0.33)
SCHEMBL5709082 0.65 CA2 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114430028-B Negative electrode slurry, negative electrode, and rechargeable battery 三星SDI株式会社 2024-10-22 CN disclosed
CN-116891941-A Method for separating metal to be separated 静冈县公立大学法人 2023-10-17 CN disclosed
CN-113748018-B Optical laminate and image display device 住友化学株式会社 2023-10-10 CN disclosed
EP-4159916-A1 COMPOSITION, SHEET-SHAPED MOLDED BODY, ARTIFICIAL LEATHER, AND SHEET-SHAPED MOLDED BODY PRODUCTION METHOD FUJIFILM Corporation (JP) 2023-04-05 EP disclosed
US-20230092375-A1 COMPOSITION, SHEET-SHAPED MOLDED BODY, ARTIFICIAL LEATHER, AND MANUFACTURING METHOD OF SHEET-SHAPED MOLDED BODY FUJIFILM CORPORATION (JP) 2023-03-23 US disclosed
CN-114430028-A Negative electrode slurry, negative electrode, and rechargeable battery 三星SDI株式会社 2022-05-03 CN disclosed
US-10699916-B2 Mold release film, process for its production, and process for producing semiconductor package AGC Inc. (JP) 2020-06-30 US disclosed
US-20170207105-A1 MOLD RELEASE FILM, PROCESS FOR ITS PRODUCTION, AND PROCESS FOR PRODUCING SEMICONDUCTOR PACKAGE ASAHI GLASS COMPANY, LIMITED (JP) 2017-07-20 US disclosed
US-7576036-B2 Heat-sensitive recording material, heat-sensitive recording method and method for manufacturing heat-sensitive recording material FUJIFILM CORPORATION (JP) 2009-08-18 US disclosed
US-20070032381-A1 Heat-sensitive recording material, heat-sensitive recording method and method for manufacturing heat-sensitive recording material FUJI PHOTO FILM CO., LTD. 2007-02-08 US disclosed
EP-1297967-B1 Thermal recording material and production method thereof FUJI PHOTO FILM CO LTD (JP) 2006-07-19 EP disclosed
US-20060116288-A1 Thermal recording material and method of manufacturing the same FUJI PHOTO FILM CO., LTD. 2006-06-01 US disclosed
US-7049269-B2 Thermal recording material and production method thereof FUJI PHOTO FILM CO., LTD. (JP) 2006-05-23 US disclosed
EP-1331104-A2 Heat sensitive recording material and recording method FUJI PHOTO FILM CO., LTD. (JP) 2003-07-30 EP disclosed
EP-1297967-A2 Thermal recording material and production method thereof FUJI PHOTO FILM CO., LTD. (JP) 2003-04-02 EP disclosed
US-4983494-A Image forming process including heating step FUJI PHOTO FILM CO., LTD. (JP) 1991-01-08 US disclosed