SCHEMBL4565339

SCHEMBL4565339

C=CCC1=Cc2cccc3cccc1c23

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.47
MAPK1 P28482 3/20 0.47
MAPT P10636 3/20 0.47
MEN1 O00255 3/20 0.47
GABRA1 P14867 1/20 0.38
GABRB2 P47870 1/20 0.38
ALDH1A1 P00352 5/20 0.36
CES2 O00748 1/20 0.36
BCHE P06276 1/20 0.36
CES1 P23141 1/20 0.36
MCL1 Q07820 1/20 0.36
S100A4 P26447 1/20 0.36
TOP2A P11388 1/20 0.35
HSD17B10 Q99714 4/20 0.34
TSHR P16473 3/20 0.34
ATM Q13315 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
CASP1 P29466 2/20 0.32
CASP7 P55210 2/20 0.32
CYP3A4 P08684 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4785447 0.88 MAPT (0.40) KMT2AMAPK1MAPTMEN1GABRA1
SCHEMBL131338 0.79 MAPK1 (0.47) KMT2AMAPK1MAPTMEN1ALDH1A1
SCHEMBL2860815 0.79 GABRA1 (0.39) KMT2AMAPTMEN1GABRA1GABRB2
SCHEMBL130313 0.76 MAPK1 (0.47) KMT2AMAPK1MAPTMEN1ALDH1A1
SCHEMBL131339 0.76 MAPK1 (0.47) KMT2AMAPK1MAPTMEN1ALDH1A1
SCHEMBL129396 0.76 MEN1 (0.47) KMT2AMAPK1MAPTMEN1ALDH1A1
SCHEMBL4512216 0.76 MEN1 (0.47) KMT2AMAPK1MAPTMEN1ALDH1A1
SCHEMBL129395 0.76 MAPK1 (0.52) KMT2AMAPK1MAPTMEN1ALDH1A1
SCHEMBL130314 0.76 MAPK1 (0.47) KMT2AMAPK1MAPTMEN1ALDH1A1
Hydrochloric Acid SCHEMBL10599412 0.74 MAPK1 (0.46) KMT2AMAPK1MAPTMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
CN-115698183-B Resin composition for wiring board material, and prepreg, resin-equipped film, resin-equipped metal foil, metal foil-clad laminate and wiring board using the resin composition 松下知识产权经营株式会社 2024-06-25 CN disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
CN-114207021-B Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2024-06-11 CN disclosed
US-20240182657-A1 RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-06 US disclosed
US-20240182614-A1 RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-06 US disclosed
EP-4372015-A1 NOVEL POLYMER, RESIN COMPOSITION INCLUDING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
EP-4372019-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
WO-2024101054-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME パナソニックIPマネジメント株式会社 2024-05-16 WO disclosed
WO-2024101056-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION パナソニックIPマネジメント株式会社 2024-05-16 WO disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070248911-A1 Pattern forming method and bilayer film IWASAWA HARUO 2007-10-25 US disclosed
US-7244549-B2 Pattern forming method and bilayer film JSR CORPORATION (JP) 2007-07-17 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-20070129502-A1 Polyphenylene ethers; improved chemical resistance, dielectric, low water-absorption, heat resistance, flame retardance, and mechanical properties; laminates NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-06-07 US disclosed
US-6852791-B2 Anti-reflection coating forming composition JSR CORPORATION (JP) 2005-02-08 US disclosed
EP-1205805-B1 Anti-reflection coating forming composition JSR CORP (JP) 2004-09-15 EP disclosed
US-20030073040-A1 Pattern forming method and bilayer film JSR CORPORATION (JP) 2003-04-17 US disclosed
US-20020086934-A1 Anti-reflection coating forming composition JSR CORPORATION (JP) 2002-07-04 US disclosed
EP-1205805-A1 Anti-reflection coating forming composition JSR Corporation (JP) 2002-05-15 EP disclosed