SCHEMBL4580204

SCHEMBL4580204

CC(N)CCC(N)CCCN

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.40
ALDH1A1 P00352 3/20 0.38
TDP1 Q9NUW8 1/20 0.33
TRPV1 Q8NER1 1/20 0.33
TRPA1 O75762 1/20 0.33
TP53 P04637 1/20 0.32
GABRP O00591 2/20 0.32
GABRD O14764 2/20 0.32
GABRA1 P14867 2/20 0.32
GABRB1 P18505 2/20 0.32
GABRG2 P18507 2/20 0.32
GABRB3 P28472 2/20 0.32
GABRA5 P31644 2/20 0.32
GABRA3 P34903 2/20 0.32
GABRA2 P47869 2/20 0.32
GABRB2 P47870 2/20 0.32
GABRA4 P48169 2/20 0.32
GABRE P78334 2/20 0.32
GABRA6 Q16445 2/20 0.32
GABRG1 Q8N1C3 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2888117 1.00 OPRM1 (0.40) OPRM1ALDH1A1TDP1TRPV1TRPA1
SCHEMBL28527284 0.95 OPRM1 (0.42) OPRM1ALDH1A1TRPV1TRPA1TP53
SCHEMBL1421157 0.92 OPRM1 (0.44) OPRM1ALDH1A1TRPV1TRPA1TP53
SCHEMBL8642555 0.90 OPRM1 (0.42) OPRM1TRPV1TRPA1
SCHEMBL1537482 0.86 NFKB1 (0.40)
SCHEMBL1537408 0.86 NFKB1 (0.40)
SCHEMBL29734802 0.86 NFKB1 (0.40)
SCHEMBL82877 0.83
SCHEMBL726430 0.83
SCHEMBL17738838 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7358312-B2 Epoxy resin curing agent of epoxy resin-liquid amine adduct and polyamidoamine HEXION SPECIALTY CHEMICALS, INC. (US) 2008-04-15 US disclosed
CN-1257206-C Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications RESOLUTION RES NEDERLAND BV (NL) 2006-05-24 CN disclosed
EP-1436339-B1 LOW VISCOSITY CURING AGENTS COMPOSITIONS IN EPOXY RESIN SYSTEMS FOR LOW TEMPERATURE CURE APPLICATIONS RESOLUTION RES NEDERLAND BV (NL) 2005-10-19 EP disclosed
US-20040242835-A1 Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications Westlake Epoxy Inc. 2004-12-02 US disclosed
CN-1549837-A Low viscosity curing agent composition for epoxy resin low temperature curing system О 2004-11-24 CN disclosed
EP-1436339-A1 LOW VISCOSITY CURING AGENTS COMPOSITIONS IN EPOXY RESIN SYSTEMS FOR LOW TEMPERATURE CURE APPLICATIONS Resolution Research Nederland B.V. (NL) 2004-07-14 EP disclosed
WO-2003020789-A1 LOW VISCOSITY CURING AGENTS COMPOSITIONS IN EPOXY RESIN SYSTEMS FOR LOW TEMPERATURE CURE APPLICATIONS RESOLUTION RESEARCH NEDERLAND B.V. (NL) 2003-03-13 WO disclosed