SCHEMBL4583233

SCHEMBL4583233

O=C(O)c1cccc(OS(=O)(=O)c2cccc(C(=O)O)c2C(=O)O)c1C(=O)O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP1A2 P05177 1/20 0.45
▸ CYP2C9 P11712 1/20 0.45
▸ CYP2C19 P33261 1/20 0.45
▸ CA1 P00915 2/20 0.41
▸ CA2 P00918 2/20 0.41
▸ CA12 O43570 1/20 0.41
▸ CA7 P43166 1/20 0.41
▸ CA9 Q16790 1/20 0.41
▸ CA14 Q9ULX7 1/20 0.41
▸ MAPT P10636 2/20 0.40
▸ ALOX15 P16050 2/20 0.40
▸ MMP1 P03956 1/20 0.40
▸ MMP2 P08253 1/20 0.40
▸ MMP9 P14780 1/20 0.40
▸ MMP8 P22894 1/20 0.40
▸ MMP13 P45452 1/20 0.40
▸ FABP4 P15090 1/20 0.39
▸ ESR1 P03372 2/20 0.38
▸ KMT2A Q03164 2/20 0.38
▸ MEN1 O00255 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL7623289 0.98 CYP1A2 (0.44) CYP1A2CYP2C9CYP2C19CA1CA2
SCHEMBL11777616 0.87 ALDH1A1 (0.45) CYP1A2CYP2C9CYP2C19CA1CA2
SCHEMBL1286026 0.84 MEN1 (0.47) CYP1A2CYP2C9CYP2C19CA1CA2
SCHEMBL11775317 0.84 MAPT (0.57) CA1CA2CA12CA7CA9
SCHEMBL15090588 0.83 CA12 (0.46) CYP1A2CYP2C9CA1CA2CA12
SCHEMBL7633011 0.83 CA1 (0.44) CA1CA2CA12CA7CA9
SCHEMBL28561935 0.80 CA1 (0.42) CA1CA2CA12CA7CA9
SCHEMBL11775342 0.80 CA12 (0.47) CYP1A2CYP2C9CA1CA2CA12
SCHEMBL11699547 0.79 FABP4 (0.45) CA1CA2CA12CA7CA9
SCHEMBL28326658 0.78 HTT (0.47) CA1CA2CA12CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107839313-B Flexible copper-clad laminate 日铁化学材料株式会社 2019-10-08 — — CN disclosed
US-20080146692-A1 Unsaturated Group-Containing Polyimide Resin, Photosensitive Resin Composition Containing Same, And Cured Product Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-06-19 — — US disclosed
EP-1826230-A1 UNSATURATED GROUP-CONTAINING POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME, AND CURED PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2007-08-29 — — EP disclosed
EP-1199333-B1 RESIN COMPOSITION CONTAINING CRYSTALLINE POLYIMIDE TEIJIN LTD (JP) 2004-07-14 — — EP disclosed
US-6646060-B1 Thermoplastic resin composition containing crystalline polyimide and thermoplastic polyester which are compatibilized at least in molten state, and polyimide is composed of units derived from aliphatic diamine and pyromellitic anhydride TEIJIN LIMITED (JP) 2003-11-11 — — US disclosed
EP-1199333-A1 RESIN COMPOSITION CONTAINING CRYSTALLINE POLYIMIDE TEIJIN LIMITED (JP) 2002-04-24 — — EP disclosed
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