SCHEMBL4584345

SCHEMBL4584345

Nc1ccc(-c2ccc(N)c(C(=O)O)c2)c(C(=O)O)c1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.70
MEN1 O00255 5/20 0.70
MAPT P10636 3/20 0.70
TDP1 Q9NUW8 3/20 0.70
USP2 O75604 3/20 0.70
THRB P10828 2/20 0.70
RECQL P46063 2/20 0.70
MCL1 Q07820 2/20 0.70
POLB P06746 2/20 0.70
PKM P14618 1/20 0.70
APEX1 P27695 1/20 0.70
BLM P54132 1/20 0.70
KDM4E B2RXH2 6/20 0.67
GFER P55789 1/20 0.67
RXFP1 Q9HBX9 1/20 0.67
ALDH1A1 P00352 5/20 0.50
HSD17B10 Q99714 3/20 0.50
CYP3A4 P08684 2/20 0.50
HPGD P15428 2/20 0.50
HIF1A Q16665 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4582858 0.85 HSD17B10 (0.58) KMT2AMEN1MAPTTDP1USP2
SCHEMBL107833 0.85 KMT2A (0.95) KMT2AMEN1MAPTTDP1USP2
SCHEMBL29201130 0.84 KMT2A (0.50) KMT2AMEN1MAPTTDP1USP2
Hydrochloric Acid SCHEMBL864766 0.83 KMT2A (1.00) KMT2AMEN1MAPTTDP1USP2
SCHEMBL10931351 0.82 KMT2A (0.50) KMT2AMEN1MAPTTDP1USP2
SCHEMBL30030661 0.82 KDM4E (0.84) KMT2AMEN1MAPTTDP1USP2
SCHEMBL1708790 0.82 KDM4E (0.84) KMT2AMEN1MAPTTDP1USP2
SCHEMBL713768 0.81 KDM4E (0.65) KMT2AMEN1MAPTTDP1USP2
SCHEMBL29498389 0.81 KMT2A (1.00) KMT2AMEN1MAPTTDP1USP2
SCHEMBL352643 0.81 KMT2A (1.00) KMT2AMEN1MAPTTDP1USP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8729178-B2 Polysiloxane-grafted polyimide resin composition and applications thereof CHI MEI CORPORATION (TW) 2014-05-20 US disclosed
US-8618236-B2 Polysiloxane-grafted polyimide resin composition and flexible substrate made therefrom CHI MEI CORPORATION (TW) 2013-12-31 US disclosed
US-20130267651-A1 POLYSILOXANE-GRAFTED POLYIMIDE RESIN COMPOSITION AND FLEXIBLE SUBSTRATE MADE THEFEFROM CHI MEI CORPORATION (TW) 2013-10-10 US disclosed
US-20130109803-A1 POLYSILOXANE-GRAFTED POLYIMIDE RESIN COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-05-02 US disclosed
US-7452610-B2 Multi-layer polyimide films and flexible circuit substrates therefrom DU PONT TORAY COMPANY LIMITED (JP) 2008-11-18 US disclosed
EP-1614535-B1 Multi-layer polyimide films and flexible circuit substrates therefrom DUPONT TORAY COMPANY LTD (JP) 2007-10-24 EP disclosed
US-20070003773-A1 Multi-layer polyimide films and flexible circuit substrates therefrom DUPONT TORAY CO. LTD. (JP) 2007-01-04 US disclosed
EP-1616898-A1 Polyamic acids, polyimide films and polyimide-metal laminates and methods for making same DuPont-Toray Company, Ltd. (JP) 2006-01-18 EP disclosed
US-20060009615-A1 Polyamic acids, polyimide films and polymide-metal laminates and methods for making same DUPONT TORAY CO. LTD. (JP) 2006-01-12 US disclosed
EP-1614535-A1 Multi-layer polyimide films and flexible circuit substrates therefrom DuPont-Toray Company, Ltd. (JP) 2006-01-11 EP disclosed