Known targets — ChEMBL curated mechanism
ACHECHRM1CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNG
The experimentally established mechanism targets of Iodide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 14/20 | 0.52 |
| ▸ | CA1 | P00915 | 13/20 | 0.52 |
| ▸ | MMP1 | P03956 | 6/20 | 0.52 |
| ▸ | MMP2 | P08253 | 6/20 | 0.52 |
| ▸ | MMP9 | P14780 | 6/20 | 0.52 |
| ▸ | MMP8 | P22894 | 6/20 | 0.52 |
| ▸ | MMP13 | P45452 | 6/20 | 0.52 |
| ▸ | F2 | P00734 | 4/20 | 0.46 |
| ▸ | PRSS1 | P07477 | 4/20 | 0.46 |
| ▸ | PRSS2 | P07478 | 4/20 | 0.46 |
| ▸ | PRSS3 | P35030 | 4/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Iodide SCHEMBL1760783 | 0.97 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL23932 | 0.97 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL30354089 | 0.97 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL1533876 | 0.94 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL3129686 | 0.94 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| Rubidium SCHEMBL19434702 | 0.94 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL6032413 | 0.94 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL561335 | 0.94 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL715939 | 0.94 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL21802716 | 0.94 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114315584-A | Photosensitizer and preparation method thereof | 宁波南大光电材料有限公司 | 2022-04-12 | — | — | CN | claimed |
| CN-102786825-B | Organic passivation layer composition and containing the transistor of organic passivation layer and electron device | SAMSUNG ELECTRONICS CO.,LTD. (KR) | 2016-06-01 | — | — | CN | claimed |
| WO-2005057285-A1 | THERMAL CURABLE ONE-LIQUID TYPE EPOXY RESIN COMPOSITION FOR OVER-COAT | SAMYANGEMS CO., LTD. (KR) | 2005-06-23 | — | — | WO | claimed |
| EP-4087948-A1 | IMAGE DIFFERENTIATED MULTIPLEX ASSAYS FOR DETECTION OF DNA MUTATIONS IN LUNG CANCER | Plexbio Co., Ltd. (TW) | 2022-11-16 | — | — | EP | disclosed |
| CN-109843853-B | Composition and method for manufacturing device using the same | 东洋合成工业株式会社 | 2022-09-20 | — | — | CN | disclosed |
| CN-114315584-A | Photosensitizer and preparation method thereof | 宁波南大光电材料有限公司 | 2022-04-12 | — | — | CN | disclosed |
| CN-102786825-B | Organic passivation layer composition and containing the transistor of organic passivation layer and electron device | SAMSUNG ELECTRONICS CO.,LTD. (KR) | 2016-06-01 | — | — | CN | disclosed |
| EP-1943287-A2 | MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE | General Electric Company (US) | 2008-07-16 | — | — | EP | disclosed |
| US-7378455-B2 | A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device | GENERAL ELECTRIC COMPANY (US) | 2008-05-27 | — | — | US | disclosed |
| EP-1788438-A1 | MATERIAL FOR FORMATION OF RESIST PROTECTION FILM AND METHOD OF FORMING RESIST PATTERN THEREWITH | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-05-23 | — | — | EP | disclosed |
| WO-2007005280-A2 | MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE | GENERAL ELECTRIC COMPANY (US) | 2007-01-11 | — | — | WO | disclosed |
| US-20070004819-A1 | A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device | CITIBANK, N.A., AS COLLATERAL AGENT | 2007-01-04 | — | — | US | disclosed |
| US-6358665-B1 | ONIUM SALT PRECURSOR FOR GENERATING FLUOROALKYLSULFONATE | CLARIANT INTERNATIONAL LTD. (CH) | 2002-03-19 | — | — | US | disclosed |
| EP-1033624-A1 | RADIATION-SENSITIVE COMPOSITION OF CHEMICAL AMPLIFICATION TYPE | Clariant International Ltd. (CH) | 2000-09-06 | — | — | EP | disclosed |