SCHEMBL4608055

SCHEMBL4608055

CC1(C(=O)OC(=O)C2(C)C3C=CC(C3)C2C(=O)O)C2C=CC(C2)C1C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 5/20 0.43
ALDH1A1 P00352 3/20 0.43
POLB P06746 3/20 0.43
CTDSP1 Q9GZU7 2/20 0.43
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
KDM4E B2RXH2 3/20 0.40
LMNA P02545 2/20 0.40
APEX1 P27695 1/20 0.31
GAA P10253 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10949610 0.89 TDP1 (0.45) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL1062711 0.84 TDP1 (0.56) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL17652072 0.84 TDP1 (0.56) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL5076356 0.84 TDP1 (0.56) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL20346213 0.83 TDP1 (0.45) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL8731646 0.79 TDP1 (0.42) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL8996568 0.77 TDP1 (0.41) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL4628271 0.77 TDP1 (0.32) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL27918485 0.75 TDP1 (0.42) TDP1ALDH1A1POLBCTDSP1MEN1
SCHEMBL8725980 0.73 TDP1 (0.52) TDP1ALDH1A1POLBCTDSP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9884950-B2 Impregnating resin for an electrical insulation body, electrical insulation body, and method for producing the electrical insulation body SIEMENS AKTIENGESELLSCHAFT (DE) 2018-02-06 US claimed
EP-2920795-B1 IMPREGNATING RESIN FOR AN ELECTRICAL INSULATION BODY, ELECTRICAL INSULATION BODY AND METHOD FOR PRODUCING THE ELECTRICAL INSULATION BODY SIEMENS AG (DE) 2016-11-02 EP claimed
US-20150361245-A1 IMPREGNATING RESIN FOR AN ELECTRICAL INSULATION BODY, ELECTRICAL INSULATION BODY, AND METHOD FOR PRODUCING THE ELECTRICAL INSULATION BODY SIEMENS AKTIENGESELLSCHAFT (DE) 2015-12-17 US claimed
CN-105153186-B Alcohol compound, (meth) acrylate ester, polymer, method for producing same, resist composition, and method for producing substrate 三菱化学株式会社 2020-05-01 CN disclosed
CN-107400140-B (meth) acrylate compound and polymer thereof 三菱化学株式会社 2020-04-07 CN disclosed
US-9884950-B2 Impregnating resin for an electrical insulation body, electrical insulation body, and method for producing the electrical insulation body SIEMENS AKTIENGESELLSCHAFT (DE) 2018-02-06 US disclosed
US-9823563-B2 Alcohol compound and method for producing same, method for producing lactone compound, (meth)acrylate ester and method for producing same, polymer and method for producing same, and resist composition and method for producing substrate using same MITSUBISHI CHEMICAL CORPORATION (JP) 2017-11-21 US disclosed
US-20150361245-A1 IMPREGNATING RESIN FOR AN ELECTRICAL INSULATION BODY, ELECTRICAL INSULATION BODY, AND METHOD FOR PRODUCING THE ELECTRICAL INSULATION BODY SIEMENS AKTIENGESELLSCHAFT (DE) 2015-12-17 US disclosed
US-20140134539-A1 ALCOHOL COMPOUND AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING LACTONE COMPOUND, (METH)ACRYLATE ESTER AND METHOD FOR PRODUCING SAME, POLYMER AND METHOD FOR PRODUCING SAME, AND RESIST COMPOSITION AND METHOD FOR PRODUCING SUBSTRATE USING SAME MITSUBISHI RAYON CO., LTD. (JP) 2014-05-15 US disclosed
EP-1408064-B1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS ZEON CORP (JP) 2008-07-30 EP disclosed
EP-1803761-A1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORPORATION (JP) 2007-07-04 EP disclosed
US-6995226-B2 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2006-02-07 US disclosed
US-20040152843-A1 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2004-08-05 US disclosed
EP-1408064-A1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS Zeon Corporation (JP) 2004-04-14 EP disclosed
EP-0847991-A1 Method for the preparation of N-(carboxyalkyl) imides DAINIPPON INK AND CHEMICALS, INC. (JP) 1998-06-17 EP disclosed
US-4110294-A POLYIMIDES CIBA-GEIGY CORPORATION (US) 1978-08-29 US disclosed