SCHEMBL4608573

SCHEMBL4608573

CC12C=CC(C1)C(O)C2O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11756474 0.68 GAA (0.31)
SCHEMBL11752893 0.68
SCHEMBL11777825 0.66 GAA (0.31)
SCHEMBL11856419 0.64
SCHEMBL11854253 0.64
SCHEMBL4635009 0.63 ALOX15 (0.31)
SCHEMBL5346134 0.62
SCHEMBL2832119 0.61 POLB (0.38)
SCHEMBL5619582 0.60
SCHEMBL11810809 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1803761-B1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORP (JP) 2016-04-27 EP claimed
EP-1803761-A1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORPORATION (JP) 2007-07-04 EP claimed
US-6995226-B2 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2006-02-07 US claimed
US-20040152843-A1 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2004-08-05 US claimed
EP-1408064-A1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS Zeon Corporation (JP) 2004-04-14 EP claimed
US-12601971-B2 Negative photosensitive resin composition ZEON CORPORATION (JP) 2026-04-14 US disclosed
WO-2024181011-A1 RESIN COMPOSITION 日本ゼオン株式会社 2024-09-06 WO disclosed
WO-2024095777-A1 RESIN COMPOSITION 日本ゼオン株式会社 2024-05-10 WO disclosed
US-20230305397-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION ZEON CORPORATION (JP) 2023-09-28 US disclosed
WO-2023127582-A1 POLYMER, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, AND ELECTRONIC COMPONENT 日本ゼオン株式会社 2023-07-06 WO disclosed
WO-2023053976-A1 RESIN COMPOSITION 日本ゼオン株式会社 2023-04-06 WO disclosed
US-11169440-B2 Radiation-sensitive resin composition and electronic component ZEON CORPORATION (JP) 2021-11-09 US disclosed
EP-1803761-A1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORPORATION (JP) 2007-07-04 EP disclosed
US-6995226-B2 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2006-02-07 US disclosed
US-20040152843-A1 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2004-08-05 US disclosed
EP-1408064-A1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS Zeon Corporation (JP) 2004-04-14 EP disclosed
US-20040029043-A1 Process for producing circuit substrates ZEON CORPORATION (JP) 2004-02-12 US disclosed
US-4106943-A RING-OPENED POLYMER OR COPOLYMER OF NORBORNENE DERIVATIVE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1978-08-15 US disclosed
US-4045416-A PROTECTIVE COATINGS UNION CARBIDE CORPORATION (US) 1977-08-30 US disclosed
US-3963771-A PROTECTIVE COATINGS UNION CARBIDE CORPORATION (US) 1976-06-15 US disclosed