SCHEMBL4609095

SCHEMBL4609095

CCCCC(CO)CC(CO)CCCC

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.71
LMNA P02545 2/20 0.64
TDP1 Q9NUW8 2/20 0.44
TSHR P16473 3/20 0.42
CYP3A4 P08684 3/20 0.42
CA2 P00918 3/20 0.40
DNM1 Q05193 2/20 0.38
FDPS P14324 1/20 0.37
CYP2D6 P10635 2/20 0.37
SPHK1 Q9NYA1 1/20 0.37
GMNN O75496 1/20 0.37
POLB P06746 1/20 0.37
THPO P40225 1/20 0.37
MTOR P42345 1/20 0.37
BLM P54132 1/20 0.37
KDM4E B2RXH2 1/20 0.37
TP53 P04637 1/20 0.37
CYP1A2 P05177 1/20 0.37
MAPT P10636 1/20 0.37
CETP P11597 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13286645 0.97 ALDH1A1 (0.68) ALDH1A1LMNATDP1TSHRCYP3A4
SCHEMBL7199870 0.97 ALDH1A1 (0.68) ALDH1A1LMNATDP1TSHRCYP3A4
SCHEMBL21693948 0.94 ALDH1A1 (0.71) ALDH1A1LMNATDP1TSHRCYP3A4
SCHEMBL28367269 0.93 ALDH1A1 (0.77) ALDH1A1LMNATDP1TSHRCYP3A4
SCHEMBL4609262 0.92 LMNA (0.76) ALDH1A1LMNATSHRCYP3A4FDPS
SCHEMBL7201076 0.91 LMNA (0.74) ALDH1A1LMNATSHRCYP3A4CA2
SCHEMBL182760 0.90 ALDH1A1 (0.81) ALDH1A1LMNATDP1TSHRCYP3A4
SCHEMBL7209429 0.90 LMNA (0.81) ALDH1A1LMNATSHRCYP3A4FDPS
SCHEMBL4609318 0.90 LMNA (0.81) ALDH1A1LMNATSHRCYP3A4FDPS
SCHEMBL7204911 0.90 LMNA (0.81) ALDH1A1LMNATSHRCYP3A4FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10227516-B2 Adhesive for food packaging films HENKEL AG & CO. KGAA (DE) 2019-03-12 US claimed
US-20250231491-A1 PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) 2025-07-17 US disclosed
US-20250231492-A1 MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) 2025-07-17 US disclosed
CN-119816784-A Fabrication of integrated circuits using positive photo-patternable dielectrics comprising high silicon content polysilsesquioxanes 潍坊星泰克微电子材料有限公司 2025-04-11 CN disclosed
CN-119631021-A Photolithography method using silicon photoresist 潍坊星泰克微电子材料有限公司 2025-03-14 CN disclosed
EP-4508495-A1 MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE Suntific Materials (Weifang), Ltd. (CN) 2025-02-19 EP disclosed
EP-4508493-A1 PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST Suntific Materials (Weifang), Ltd. (CN) 2025-02-19 EP disclosed
WO-2025000535-A1 MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE SUNTIFIC MATERIALS (WEIFANG), LTD. (CN) 2025-01-02 WO disclosed
WO-2025000537-A1 PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST SUNTIFIC MATERIALS (WEIFANG), LTD. (CN) 2025-01-02 WO disclosed
EP-3585620-B1 3D PRINTING DEVICES INCLUDING MIXING NOZZLES KORNIT DIGITAL TECH LTD (IL) 2024-05-15 EP disclosed
EP-0909752-B1 DI(METH)ACRYLATES KYOWA YUKA KK (JP) 2001-09-05 EP disclosed
US-6143840-A BLEND OF AMINO RESIN WITH A POLYESTER COMPRISING UNITS DERIVED FROM 2,4-DIALKYL-1,5-PENTANEDIOL OR 2-ALKYL-1,5-PENTANEDIOL; CURED RESIN OBTAINED BY HARDENING THE BLEND HAVING ALKALI AND HYDROLYSIS RESISTANCE; PAINT KYOWA YUKA CO., LTD. (JP) 2000-11-07 US disclosed
US-6087466-A POLYESTERURETHANE COPOLYMERS KYOWA YUKA CO., LTD. (JP) 2000-07-11 US disclosed
EP-1000994-A1 POLYURETHANE ADHESIVE, METHOD FOR USE IN BONDING, AND USE OF MIXTURE Kyowa Yuka Co., Ltd. (JP) 2000-05-17 EP disclosed
US-6048956-A DIGLYCIDYL ETHERS OF DIOLS KYOWA YUKA CO., LTD. (JP) 2000-04-11 US disclosed
EP-0970995-A1 POLYESTER RESIN COMPOSITION, CURED RESIN, AND COATING MATERIAL Kyowa Yuka Co., Ltd. (JP) 2000-01-12 EP disclosed
US-5952437-A Polyurethane KYOWA HAKKO KOGYO CO., LTD. (JP) 1999-09-14 US disclosed
EP-0911326-A1 DIGLYCIDYL ETHERS Kyowa Yuka Co., Ltd. (JP) 1999-04-28 EP disclosed
EP-0909752-A1 DI(METH)ACRYLATES Kyowa Yuka Co., Ltd. (JP) 1999-04-21 EP disclosed
EP-0908481-A1 POLYURETHANES AND POLYESTER POLYOLS Kyowa Yuka Co., Ltd. (JP) 1999-04-14 EP disclosed