SCHEMBL4618875

SCHEMBL4618875

CC(C)(C)c1ccccc1[SiH](OCc1ccccc1[N+](=O)[O-])OCc1ccccc1[N+](=O)[O-]

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.43
HTT P42858 2/20 0.43
MAOB P27338 1/20 0.42
TSHR P16473 2/20 0.42
NPSR1 Q6W5P4 1/20 0.41
CA12 O43570 1/20 0.40
CA9 Q16790 1/20 0.40
HPGD P15428 1/20 0.39
HTR1A P08908 1/20 0.37
ADRA1D P25100 1/20 0.37
ADRA1A P35348 1/20 0.37
ADRA1B P35368 1/20 0.37
ACHE P22303 1/20 0.36
KDM4E B2RXH2 1/20 0.36
GAA P10253 1/20 0.36
MAPT P10636 1/20 0.36
MAPK1 P28482 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
KMT2A Q03164 3/20 0.36
TDP1 Q9NUW8 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4620386 0.82 HSD17B10 (0.49) ALDH1A1HTTMAOBTSHRCA12
SCHEMBL10541184 0.77 ALDH1A1 (0.49) ALDH1A1HTTMAOBTSHRNPSR1
SCHEMBL4619267 0.77 ALDH1A1 (0.50) ALDH1A1HTTMAOBTSHRCA12
SCHEMBL11113892 0.76 ALDH1A1 (0.43) ALDH1A1HTTMAOBTSHRNPSR1
SCHEMBL7156221 0.73 NPC1 (0.45) ALDH1A1HTTMAOBHPGDHTR1A
SCHEMBL11113888 0.73 ALDH1A1 (0.45) ALDH1A1HTTMAOBTSHRCA12
SCHEMBL1814272 0.72 ALDH1A1 (0.53) ALDH1A1HTTMAOBTSHRNPSR1
SCHEMBL4620024 0.71 ALDH1A1 (0.43) ALDH1A1HTTMAOBTSHRCA12
SCHEMBL419987 0.71 NPSR1 (0.59) ALDH1A1HTTTSHRNPSR1L3MBTL1
SCHEMBL30486812 0.71 NPSR1 (0.59) ALDH1A1HTTTSHRNPSR1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6262147-B1 AS TOP COATS TO AUTOMOBILES KANSAI PAINT CO., LTD. (JP) 2001-07-17 US disclosed
US-5338879-A Useful in coating compositions; curable DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1994-08-16 US disclosed
EP-0459913-B1 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEM (JP) 1994-07-27 EP disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 EP disclosed
US-5198509-A Curable composition with epoxy groups and esters DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-03-30 US disclosed
US-5169965-A Heat-curable or photocurable compounds; coatings; toughness; finishing; low-temperature cure DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-12-08 US disclosed
EP-0466596-A2 Lactone-modified alicyclic composition, and an epoxidized composition thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-01-15 EP disclosed
EP-0459913-A2 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1991-12-04 EP disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed