SCHEMBL4619590

SCHEMBL4619590

C=CC[SiH](OCc1ccccc1[N+](=O)[O-])c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.43
HTT P42858 1/20 0.43
TSHR P16473 1/20 0.42
MAOB P27338 1/20 0.40
HPGD P15428 1/20 0.39
CA12 O43570 1/20 0.38
CA9 Q16790 1/20 0.38
HTR1A P08908 1/20 0.37
ADRA1D P25100 1/20 0.37
ADRA1A P35348 1/20 0.37
ADRA1B P35368 1/20 0.37
KDM4E B2RXH2 1/20 0.36
NPC1 O15118 3/20 0.36
RAB9A P51151 3/20 0.36
KMT2A Q03164 2/20 0.36
MEN1 O00255 1/20 0.36
KDM4A O75164 1/20 0.35
RECQL P46063 1/20 0.35
KDM1A O60341 1/20 0.34
SIGMAR1 Q99720 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4619696 0.84 PDE7A (0.33) ALDH1A1TSHRHPGDKDM4ENPC1
SCHEMBL11120018 0.84 ALDH1A1 (0.45) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL4618688 0.82 MAOB (0.43) TSHRMAOBCA12CA9HTR1A
SCHEMBL4620024 0.79 ALDH1A1 (0.43) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL10788778 0.76 ALDH1A1 (0.48) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL11113888 0.76 ALDH1A1 (0.45) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL23630884 0.74 MEN1 (0.39) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL10404273 0.73 ALDH1A1 (0.50) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL10389234 0.72 ALDH1A1 (0.53) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL11107441 0.71 ALDH1A1 (0.46) ALDH1A1HTTTSHRMAOBHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6096836-A OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND KABUSHIKI KAISHA TOSHIBA (JP) 2000-08-01 US disclosed
US-5811497-A STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH KABUSHIKI KAISHA TOSHIBA (JP) 1998-09-22 US disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
EP-0139234-B1 RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1989-11-29 EP disclosed
US-4831063-A RAPID CURING OF AN UNSATURATED EPOXY/ORGANOALUMINUM COMPOUND MIXTURE BY ADDING A SILYLPEROXY COMPOUND; PAINTS; COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-16 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed