SCHEMBL4619696

SCHEMBL4619696

C=CC[SiH](OCc1cc(Cl)c(Cl)cc1[N+](=O)[O-])c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PDE7A Q13946 2/20 0.33
L3MBTL1 Q9Y468 2/20 0.32
KMT2A Q03164 2/20 0.32
MEN1 O00255 1/20 0.32
VCAM1 P19320 3/20 0.32
HPGD P15428 1/20 0.32
ALDH1A1 P00352 2/20 0.32
TSHR P16473 1/20 0.32
PIN1 Q13526 2/20 0.32
MAPT P10636 2/20 0.32
MAPK1 P28482 1/20 0.32
KDM4E B2RXH2 1/20 0.31
CYP1A2 P05177 1/20 0.31
NPC1 O15118 1/20 0.31
RAB9A P51151 1/20 0.31
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4619590 0.84 ALDH1A1 (0.43) KMT2AMEN1HPGDALDH1A1TSHR
SCHEMBL4619695 0.71 ALDH1A1 (0.34) PDE7AL3MBTL1KMT2AMEN1HPGD
SCHEMBL8842552 0.71 HSD17B10 (0.37) PDE7AL3MBTL1KMT2AMEN1VCAM1
SCHEMBL6335741 0.71 HTT (0.40) L3MBTL1KMT2AMEN1HPGDALDH1A1
SCHEMBL4619692 0.70 MAPT (0.34) PDE7AL3MBTL1KMT2AMEN1VCAM1
SCHEMBL11120018 0.69 ALDH1A1 (0.45) KMT2AMEN1HPGDALDH1A1TSHR
SCHEMBL4618688 0.68 MAOB (0.43) KMT2AMEN1TSHRMAPTMAPK1
SCHEMBL28529326 0.66 HSD17B10 (0.40) PDE7AVCAM1ALDH1A1TSHRMAPK1
SCHEMBL18138458 0.65 TSHR (0.44) PDE7AVCAM1ALDH1A1TSHRMAPK1
SCHEMBL135716 0.65 MEN1 (0.32) KMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6319557-B1 FORMING MULTILAYER OVERCOATING, COLORING, THERMOSETTING RESIN FILMS, EPOXY ACRYLIC RESINS AND CATALYST KANSAI PAINT CO., LTD. (JP) 2001-11-20 US disclosed
EP-0466596-A2 Lactone-modified alicyclic composition, and an epoxidized composition thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-01-15 EP disclosed
EP-0459913-A2 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1991-12-04 EP disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
EP-0139234-B1 RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1989-11-29 EP disclosed
US-4831063-A RAPID CURING OF AN UNSATURATED EPOXY/ORGANOALUMINUM COMPOUND MIXTURE BY ADDING A SILYLPEROXY COMPOUND; PAINTS; COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-16 US disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed