SCHEMBL4619903

SCHEMBL4619903

C=C(C)C(=O)OCCc1cccc2c1C(=O)NC2=O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 4/20 0.44
▸ ALDH1A1 P00352 3/20 0.44
▸ GAA P10253 2/20 0.44
▸ HPGD P15428 1/20 0.44
▸ HSD17B10 Q99714 1/20 0.44
▸ CASP3 P42574 7/20 0.39
▸ CA1 P00915 1/20 0.38
▸ CA2 P00918 1/20 0.38
▸ THRB P10828 1/20 0.38
▸ POLB P06746 2/20 0.35
▸ APEX1 P27695 1/20 0.35
▸ HTT P42858 1/20 0.35
▸ TDP1 Q9NUW8 1/20 0.35
▸ GSK3B P49841 2/20 0.34
▸ GSK3A P49840 1/20 0.34
▸ CDK5 Q00535 1/20 0.34
▸ CDK5R1 Q15078 1/20 0.34
▸ TSHR P16473 2/20 0.34
▸ RXFP1 Q9HBX9 2/20 0.34
▸ CASP2 P42575 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11576353 0.82 ALDH1A1 (0.43) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL12097976 0.81 THRB (0.43) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL16561335 0.78 KDM4E (0.48) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL28177431 0.75 ALDH1A1 (0.50) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL28633753 0.75 KDM4E (0.50) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL5970012 0.75 GSK3B (0.50) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL30225439 0.74 KDM4E (0.39) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL31474424 0.74 ALDH1A1 (0.49) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL728356 0.74 KDM4E (0.36) KDM4EALDH1A1GAAHPGDHSD17B10
SCHEMBL27459251 0.74 KMT2A (0.44) CA1CA2THRBPOLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250297146-A1 WET AND DRY ADHESIVE SHAPE MEMORY ELASTOMERS THE CURATORS OF THE UNIVERSITY OF MISSOURI 2025-09-25 — — US disclosed
US-11850625-B2 Syringe filled with resin composition and storage method therefor NAMICS CORPORATION (JP) 2023-12-26 — — US disclosed
US-20230411335-A1 THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT KYOCERA CORPORATION (JP) 2023-12-21 — — US disclosed
US-11784153-B2 Thermosetting resin composition, semiconductor device, and electrical/electronic component KYOCERA CORPORATION (JP) 2023-10-10 — — US disclosed
US-11623813-B2 Resin composition-filled syringe, and production method and preservation method for same NAMICS CORPORATION (JP) 2023-04-11 — — US disclosed
US-20220144531-A1 RESIN COMPOSITION-FILLED SYRINGE, AND PRODUCTION METHOD AND PRESERVATION METHOD FOR SAME NAMICS CORPORATION (JP) 2022-05-12 — — US disclosed
US-11072710-B2 Surface-treated silica filler, and resin composition containing surface-treated silica filler NAMICS CORPORATION (JP) 2021-07-27 — — US disclosed
WO-2020162274-A1 SYRINGE FILLED WITH RESIN COMPOSITION AND STORAGE METHOD THEREFOR ナミックス株式会社 2020-08-13 — — WO disclosed
US-20190338138-A1 SURFACE-TREATED SILICA FILLER, AND RESIN COMPOSITION CONTAINING SURFACE-TREATED SILICA FILLER NAMICS CORPORATION (JP) 2019-11-07 — — US disclosed
US-20190338171-A1 THERMALLY CONDUCTIVE PASTE AND ELECTRONIC DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2019-11-07 — — US disclosed
US-9379051-B2 Semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2016-06-28 — — US disclosed
US-20150194376-A1 SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2015-07-09 — — US disclosed
EP-2514781-B1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME SHOWA DENKO KK (JP) 2015-04-22 — — EP disclosed
US-20140309326-A1 CURABLE COMPOSITION SHOWA DENKO K.K. (JP) 2014-10-16 — — US disclosed
EP-2757121-A2 Curable composition Showa Denko K.K. (JP) 2014-07-23 — — EP disclosed
EP-2757122-A2 Photocurable moisture-proof insulating coating material for mounting circuit boards Showa Denko K.K. (JP) 2014-07-23 — — EP disclosed
EP-2514781-A1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME Showa Denko K.K. (JP) 2012-10-24 — — EP disclosed
US-20120232183-A1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION COMPRISING SAME SHOWA DENKO K.K. (JP) 2012-09-13 — — US disclosed
EP-1945344-A2 PHOTO-RESPONSIVE MICROENCAPSULATION MATERIALS, COMPOSITIONS AND METHODS OF USE THEREOF Solarbre, Inc. (US) 2008-07-23 — — EP disclosed
WO-2007051198-A2 PHOTO-RESPONSIVE MICROENCAPSULATION MATERIALS, COMPOSITIONS AND METHODS OF USE THEREOF SOLARBRE, INC (US) 2007-05-03 — — WO disclosed
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