SCHEMBL4620118

SCHEMBL4620118

Cc1ccccc1[SiH](OC(c1ccccc1[N+](=O)[O-])c1ccccc1[N+](=O)[O-])OC(c1ccccc1[N+](=O)[O-])c1ccccc1[N+](=O)[O-]

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.49
ALDH1A1 P00352 6/20 0.44
TSHR P16473 3/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
CYP1A2 P05177 3/20 0.39
TDP1 Q9NUW8 5/20 0.39
L3MBTL1 Q9Y468 2/20 0.38
MAPT P10636 3/20 0.36
CDK5 Q00535 1/20 0.36
CDK5R1 Q15078 1/20 0.36
ESR1 P03372 1/20 0.35
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
RECQL P46063 2/20 0.35
NPC1 O15118 2/20 0.35
RAB9A P51151 2/20 0.35
GLA P06280 1/20 0.35
POLB P06746 1/20 0.35
CYP3A4 P08684 1/20 0.35
CYP2D6 P10635 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10695193 0.74 ALDH1A1 (0.47) HSD17B10ALDH1A1TSHRSMN1; SMN2CYP1A2
SCHEMBL2777973 0.72 ALDH1A1 (0.54) HSD17B10ALDH1A1TSHRCYP1A2TDP1
O-Xylene SCHEMBL27374726 0.72 HSD17B10 (0.82) HSD17B10ALDH1A1TSHRSMN1; SMN2TDP1
SCHEMBL4620386 0.71 HSD17B10 (0.49) HSD17B10ALDH1A1TSHRSMN1; SMN2TDP1
SCHEMBL10695200 0.71 HSD17B10 (0.49) HSD17B10ALDH1A1TSHRSMN1; SMN2CYP1A2
SCHEMBL8728613 0.70 ALDH1A1 (0.51) HSD17B10ALDH1A1TSHRSMN1; SMN2CYP1A2
SCHEMBL8728605 0.70 ALDH1A1 (0.51) HSD17B10ALDH1A1TSHRCYP1A2TDP1
SCHEMBL9679556 0.70 ALDH1A1 (0.51) HSD17B10ALDH1A1TSHRCYP1A2TDP1
SCHEMBL4617975 0.69 ALDH1A1 (0.51) HSD17B10ALDH1A1TSHRSMN1; SMN2CYP1A2
SCHEMBL10694617 0.69 ALDH1A1 (0.51) HSD17B10ALDH1A1TSHRSMN1; SMN2CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
CN-112292414-A Cation-curable composition and method for producing cured product 迪睿合株式会社 2021-01-29 CN disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
EP-0459913-B1 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEM (JP) 1994-07-27 EP disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 EP disclosed
US-5198509-A Curable composition with epoxy groups and esters DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-03-30 US disclosed
US-5169965-A Heat-curable or photocurable compounds; coatings; toughness; finishing; low-temperature cure DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-12-08 US disclosed
EP-0466596-A2 Lactone-modified alicyclic composition, and an epoxidized composition thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-01-15 EP disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0282634-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1988-09-21 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed