SCHEMBL4621114

SCHEMBL4621114

O=[N+]([O-])c1ccccc1CO[Si](OCc1ccccc1[N+](=O)[O-])(c1ccccc1)c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.50
HTT P42858 1/20 0.50
TSHR P16473 1/20 0.50
HPGD P15428 1/20 0.46
MAOB P27338 1/20 0.46
NPC1 O15118 4/20 0.43
RAB9A P51151 4/20 0.43
KMT2A Q03164 2/20 0.43
CA12 O43570 1/20 0.43
CA9 Q16790 1/20 0.43
RECQL P46063 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2D6 P10635 1/20 0.40
CYP2C19 P33261 1/20 0.40
MEN1 O00255 1/20 0.40
AR P10275 1/20 0.40
KDM1A O60341 1/20 0.40
SIGMAR1 Q99720 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4620482 0.94 ALDH1A1 (0.48) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL4619962 0.92 ALDH1A1 (0.47) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL11099695 0.88 NPC1 (0.50) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL10426153 0.88 ALDH1A1 (0.46) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL4619256 0.87 ALDH1A1 (0.50) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL4620141 0.87 ALDH1A1 (0.50) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL11109958 0.86 PTPN1 (0.51) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL8033745 0.85 CA12 (0.41) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL11108170 0.84 ALDH1A1 (0.49) ALDH1A1HTTTSHRHPGDMAOB
Ethane SCHEMBL8643809 0.84 ALDH1A1 (0.48) ALDH1A1HTTTSHRHPGDMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025122450-A1 PHOTOCAGED METAL/METALLOID-ALKOXY AND SILOXANE POLYMER BUILDING BLOCKS AND APPLICATIONS THEREOF BOWLING GREEN STATE UNIVERSITY (US) 2025-06-12 WO claimed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 US claimed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP claimed
JP-59099782-A None JP disclosed
JP-59098127-A None JP disclosed
WO-2025122450-A1 PHOTOCAGED METAL/METALLOID-ALKOXY AND SILOXANE POLYMER BUILDING BLOCKS AND APPLICATIONS THEREOF BOWLING GREEN STATE UNIVERSITY (US) 2025-06-12 WO disclosed
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 US disclosed
US-4476290-A Photocurable silicon compound composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1984-10-09 US disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed
JP-S5999782-A RESIN-SEALED LIGHT EMITTING DEVICE AND MANUFACTURE THEREOF TOSHIBA CORP 1984-06-08 JP disclosed
JP-S5998127-A PHOTOPOLYMERIZABLE COMPOSITION TOSHIBA CORP 1984-06-06 JP disclosed
EP-0104590-A1 Photocurable silicon compound composition KABUSHIKI KAISHA TOSHIBA (JP) 1984-04-04 EP disclosed
EP-0091131-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1983-10-12 EP disclosed