SCHEMBL4620141

SCHEMBL4620141

O=[N+]([O-])c1ccccc1CO[Si](c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.50
HTT P42858 1/20 0.50
TSHR P16473 1/20 0.50
HPGD P15428 1/20 0.46
MAOB P27338 1/20 0.46
NPC1 O15118 4/20 0.43
RAB9A P51151 4/20 0.43
KMT2A Q03164 2/20 0.43
CA12 O43570 1/20 0.43
CA9 Q16790 1/20 0.43
CYP2C19 P33261 2/20 0.42
POLB P06746 1/20 0.42
RECQL P46063 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2D6 P10635 1/20 0.40
MEN1 O00255 1/20 0.40
MET P08581 1/20 0.40
AR P10275 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethane SCHEMBL8643809 0.97 ALDH1A1 (0.48) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL10426765 0.92 ALDH1A1 (0.44) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL10426255 0.92 ALDH1A1 (0.44) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL10426120 0.88 NPC1 (0.50) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL10426119 0.88 ALDH1A1 (0.46) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL4621114 0.87 ALDH1A1 (0.50) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL4619256 0.87 ALDH1A1 (0.50) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL6906721 0.86 POLB (0.45) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL10426339 0.85 ALDH3A1 (0.44) ALDH1A1HTTTSHRHPGDMAOB
SCHEMBL4618336 0.84 ALDH1A1 (0.48) ALDH1A1HTTTSHRHPGDMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025122450-A1 PHOTOCAGED METAL/METALLOID-ALKOXY AND SILOXANE POLYMER BUILDING BLOCKS AND APPLICATIONS THEREOF BOWLING GREEN STATE UNIVERSITY (US) 2025-06-12 WO claimed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 US claimed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP claimed
JP-62153335-A None JP disclosed
WO-2025122450-A1 PHOTOCAGED METAL/METALLOID-ALKOXY AND SILOXANE POLYMER BUILDING BLOCKS AND APPLICATIONS THEREOF BOWLING GREEN STATE UNIVERSITY (US) 2025-06-12 WO disclosed
CN-111205685-B LED-UV solvent-free spraying primer and method for applying same to coating of thermosensitive substrate 成都迪泰化工有限公司 2021-09-07 CN disclosed
CN-111205685-A LED-UV solvent-free spraying primer and method for applying same to coating of paper, solid wood, plastic and other heat-sensitive substrates 成都迪泰化工有限公司 2020-05-29 CN disclosed
US-9448334-B2 Optical waveguide and dry film for optical waveguide production PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2016-09-20 US disclosed
US-20150234095-A1 OPTICAL WAVEGUIDE AND DRY FILM FOR OPTICAL WAVEGUIDE PRODUCTION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2015-08-20 US disclosed
US-7811475-B2 Neutron shielding material composition, shielding material and container MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) 2010-10-12 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0172330-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1986-02-26 EP disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 US disclosed
US-4476290-A Photocurable silicon compound composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1984-10-09 US disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed
EP-0104590-A1 Photocurable silicon compound composition KABUSHIKI KAISHA TOSHIBA (JP) 1984-04-04 EP disclosed
EP-0091131-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1983-10-12 EP disclosed