SCHEMBL465145

SCHEMBL465145

C=C(C(=O)OCC)N1CC1

nearest known ligand 0.46

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.46
POLB P06746 2/20 0.46
HTT P42858 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
TSHR P16473 2/20 0.45
MAPT P10636 4/20 0.44
RECQL P46063 1/20 0.43
GAA P10253 5/20 0.42
KDM4E B2RXH2 2/20 0.42
LMNA P02545 2/20 0.41
ABL1 P00519 1/20 0.40
RIN1 Q13671 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
PKM P14618 1/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21925345 0.92 ALDH1A1 (0.42) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL2034265 0.90 ALDH1A1 (0.41) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL29109686 0.90 ALDH1A1 (0.41) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL29049790 0.87 MAPT (0.39) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL3134341 0.87 TSHR (0.62) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL28024989 0.83 TSHR (0.40) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL28796394 0.81 TSHR (0.56) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL12496523 0.77 MAPT (0.67) ALDH1A1POLBHTTSMN1; SMN2TSHR
SCHEMBL21925353 0.76 L3MBTL1 (0.39) ALDH1A1POLBSMN1; SMN2TSHRLMNA
SCHEMBL27777215 0.75 L3MBTL1 (0.41) ALDH1A1SMN1; SMN2TSHRTDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117043196-A Polymer latex composition 昕特玛私人有限公司 2023-11-10 CN claimed
CN-110964400-A Aqueous wood lacquer emulsion and preparation method and application thereof 中国科学院化学研究所 2020-04-07 CN claimed
US-4136042-A EXTREME PRESSURE LUBRICANTS GULF RESEARCH & DEVELOPMENT COMPANY (US) 1979-01-23 US claimed
CN-117043196-A Polymer latex composition 昕特玛私人有限公司 2023-11-10 CN disclosed
CN-112585733-A Substrate for adhesive sheet and adhesive sheet for processing electronic component 琳得科株式会社 2021-03-30 CN disclosed
CN-110964400-A Aqueous wood lacquer emulsion and preparation method and application thereof 中国科学院化学研究所 2020-04-07 CN disclosed
CN-108474119-B Surface-treated steel sheet and method for producing surface-treated steel sheet 日本制铁株式会社 2020-01-14 CN disclosed
CN-105247661-B The manufacturing method of semiconductor wafer protection film and semiconductor device 三井化学东赛璐株式会社 2018-09-21 CN disclosed
CN-105247661-A Adjustable mass resolving aperture MITSUI CHEMICALS TOHCELLO INC 2016-01-13 CN disclosed
WO-2012026786-A3 DISPLACEMENT DESORPTION PROCESS FOR LIGHT OLEFIN SEPARATION KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2012-05-10 WO disclosed
EP-2050772-B1 CURABLE RESIN AND CURABLE COMPOSITION MITSUI CHEMICALS INC (JP) 2011-11-30 EP disclosed
US-20100036050-A1 CURABLE RESIN AND CURABLE COMPOSITION CEMEDINE CO., LTD. (JP) 2010-02-11 US disclosed
EP-2050772-A1 CURABLE RESIN AND CURABLE COMPOSITION Mitsui Chemicals Polyurethanes, Inc. (JP) 2009-04-22 EP disclosed
US-20080124552-A1 Particle With Rough Surface For Plating Or Vapor Deposition NISSHINBO INDUSTRIES, INC. (JP) 2008-05-29 US disclosed
US-20080020207-A1 Particle With Rough Surface And Process For Producing The Same NISSHINBO INDUSTRIES, INC. (JP) 2008-01-24 US disclosed
US-7201969-B2 Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film MITSUI CHEMICALS, INC. (JP) 2007-04-10 US disclosed
US-20050203250-A1 Pressure-sensitive adhesive film for the suface protection of semiconductor wafers and method for protection of semiconductor wafers with the film MITSUI CHEMICALS, INC. (JP) 2005-09-15 US disclosed
EP-0493846-B1 Multifunctional additive for lubricating oils MINI RICERCA SCIENT TECNOLOG (IT) 1994-02-23 EP disclosed
US-4107156-A Process for preparing gel polymer of vinyl compound and gel polymer thereof MITSUBISHI RAYON CO., LTD. (JP) 1978-08-15 US disclosed