SCHEMBL465157

SCHEMBL465157

CCCCOOC1(OOCCCC)CCC(C(C)(C)C2CCC(OOCCCC)(OOCCCC)CC2)CC1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.31
S1PR3 Q99500 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4659212 0.81 CYP1A2 (0.35) SMN1; SMN2
SCHEMBL28926075 0.76 CYP1A2 (0.34)
SCHEMBL33372529 0.74
SCHEMBL340096 0.74 MEN1 (0.33)
SCHEMBL2100547 0.74 MEN1 (0.33)
SCHEMBL3284303 0.72
SCHEMBL4815431 0.71 SMN1; SMN2 (0.32) SMN1; SMN2
SCHEMBL5621053 0.68
SCHEMBL4758452 0.67 THRB (0.32)
SCHEMBL28723145 0.67 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 166 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170102347-A1 BIOCHEMICAL TEST CHIP APEX BIOTECHNOLOGY CORP. (TW) 2017-04-13 US claimed
EP-3153857-A1 BIOCHEMICAL TEST CHIP Apex Biotechnology Corporation (TW) 2017-04-12 EP claimed
JP-7228609-A None JP disclosed
US-12165788-B2 Insulation sheet and producing method therefor, and rotary electric machine MITSUBISHI ELECTRIC CORPORATION (JP) 2024-12-10 US disclosed
WO-2024157445-A1 INSULATING SHEET AND MANUFACTURING METHOD THEREFOR, INSULATING TREATMENT METHOD, AND METHOD FOR MANUFACTURING ROTARY ELECTRICAL MACHINE 三菱電機株式会社 2024-08-02 WO disclosed
US-12043734-B2 Sheet-form insulating varnish and producing method therefor, electrical device, and rotary electric machine MITSUBISHI ELECTRIC CORPORATION (JP) 2024-07-23 US disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
US-11958274-B2 Curable composition for polymer electrolyte, and layered body TOAGOSEI CO., LTD. (JP) 2024-04-16 US disclosed
US-20240052077-A1 Two-Component Curable Composition and Cured Product Thereof COSMO OIL LUBRICANTS CO., LTD. (JP) 2024-02-15 US disclosed
EP-4317212-A1 CURABLE COMPOSITION, AND CURED PRODUCT Cosmo Oil Lubricants Co., Ltd. (JP) 2024-02-07 EP disclosed
WO-2023238835-A1 SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL 東亞合成株式会社 2023-12-14 WO disclosed
US-20040249073-A1 Transparent rubber-modified copolymer resin and resin composition containing the same DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2004-12-09 US disclosed
US-20040192844-A1 Styrene polymer resin and composition thereof PS JAPAN CORPORATION (JP) 2004-09-30 US disclosed
EP-1447417-A1 TRANSPARENT RUBBER−MODIFIED COPOLYMER RESIN AND RESIN COMPOSITION CONTAINING THE SAME DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2004-08-18 EP disclosed
EP-1416301-A9 Material composition for producing optical waveguide and method for producing optical waveguide Toyoda Gosei Co., Ltd. (JP) 2004-07-14 EP disclosed
US-20040131320-A1 Material composition for producing optical waveguide and method for producing optical waveguide TOYODA GOSEI CO., LTD. (JP) 2004-07-08 US disclosed
EP-1416301-A1 Material composition for producing optical-waveguide and method for producing optical waveguide Toyoda Gosei Co., Ltd. (JP) 2004-05-06 EP disclosed
US-20030191228-A1 Conductive curable resin composition and separator for fuel cell SHOW DENKO K.K. (JP) 2003-10-09 US disclosed
US-20030162012-A1 Expanded polypropylene resin bead and process of producing same JSP CORPORATION (JP) 2003-08-28 US disclosed
JP-H07228609-A PRODUCTION OF BINDER RESIN FOR TONER MITSUBISHI RAYON CO LTD 1995-08-29 JP disclosed