Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RAB9A | P51151 | 9/20 | 0.55 |
| ▸ | NPC1 | O15118 | 8/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.55 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.53 |
| ▸ | MEN1 | O00255 | 6/20 | 0.51 |
| ▸ | MAPT | P10636 | 4/20 | 0.51 |
| ▸ | PKM | P14618 | 2/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | POLB | P06746 | 1/20 | 0.50 |
| ▸ | APEX1 | P27695 | 1/20 | 0.50 |
| ▸ | KCNQ3 | O43525 | 1/20 | 0.49 |
| ▸ | KCNQ2 | O43526 | 1/20 | 0.49 |
| ▸ | FKBP5 | Q13451 | 1/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.49 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.49 |
| ▸ | THRB | P10828 | 1/20 | 0.49 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.49 |
| ▸ | RECQL | P46063 | 1/20 | 0.49 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26416447 | 0.95 | RAB9A (0.61) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL17744810 | 0.95 | NPC1 (0.58) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL31615133 | 0.94 | RAB9A (0.50) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL11468423 | 0.90 | POLB (0.66) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL11594692 | 0.90 | RAB9A (0.66) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL17744813 | 0.90 | KCNK3 (0.61) | RAB9AKMT2AMEN1POLBTP53 | |
| SCHEMBL11493901 | 0.90 | KMT2A (0.66) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL27888577 | 0.89 | KMT2A (0.59) | RAB9ANPC1KMT2AMEN1MAPT | |
| SCHEMBL30409629 | 0.87 | HDAC1 (0.58) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 | |
| SCHEMBL22025293 | 0.87 | HDAC1 (0.64) | RAB9ANPC1KMT2ASMN1; SMN2MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240376348-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2024-11-14 | — | — | US | disclosed |
| WO-2024204181-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024204336-A1 | RESIN COMPOSITION, CURED ARTICLE, SUBSTRATE WITH CURED ARTICLE, LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2024-10-03 | — | — | WO | disclosed |
| EP-4397731-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2024-07-10 | — | — | EP | disclosed |
| WO-2023032888-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-11186757-B2 | Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2021-11-30 | — | — | US | disclosed |
| US-20210139700-A1 | RESIN COMPOSITION, RESIN LAYER, PERMANENT ADHESIVE, ADHESIVE FOR TEMPORARY BONDING, LAMINATED FILM, PROCESSED WAFER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-10941320-B2 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion | TORAY INDUSTRIES, INC. (JP) | 2021-03-09 | — | — | US | disclosed |
| EP-3187559-B1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, METHOD FOR MANUFACTURING WAFER WORK PIECE AND SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2021-02-17 | — | — | EP | disclosed |
| EP-2902447-B1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-10-28 | — | — | EP | disclosed |
| US-20160372357-A1 | POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM | TORAY INDUSTRIES, INC. (JP) | 2016-12-22 | — | — | US | disclosed |
| US-20150228527-A1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2015-08-13 | — | — | US | disclosed |
| EP-2902447-A1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2015-08-05 | — | — | EP | disclosed |
| EP-2735580-A1 | POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME | Toray Industries, Inc. (JP) | 2014-05-28 | — | — | EP | disclosed |
| EP-1739114-B1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2008-12-17 | — | — | EP | disclosed |
| US-20070260035-A1 | Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device | TORAY INDUSTRIES, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| US-20070169886-A1 | Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2007-07-26 | — | — | US | disclosed |
| EP-1739114-A1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2007-01-03 | — | — | EP | disclosed |
| EP-1721740-A1 | HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2006-11-15 | — | — | EP | disclosed |
| US-4122117-A | Indandione bis-azomethine pigments | DAINIPPON INK & CHEMICALS, INC. (JP) | 1978-10-24 | — | — | US | disclosed |