SCHEMBL7051999

SCHEMBL7051999

CNc1ccc(C2(c3ccc(NC)cc3)c3ccccc3-c3c(C)cccc32)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
SMN1; SMN2 Q16637 2/20 0.45
KDM4E B2RXH2 1/20 0.45
LMNA P02545 1/20 0.45
MAPT P10636 1/20 0.45
OPRK1 P41145 1/20 0.45
PDK2 Q15119 5/20 0.44
GFER P55789 1/20 0.42
ESR1 P03372 1/20 0.42
ESR2 Q92731 1/20 0.42
POLB P06746 1/20 0.39
NUDT1 P36639 1/20 0.35
TSHR P16473 2/20 0.34
HTT P42858 2/20 0.33
CNR1 P21554 1/20 0.33
GPR35 Q9HC97 1/20 0.33
GPR55 Q9Y2T6 1/20 0.33
MYC P01106 1/20 0.32
CA1 P00915 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22617847 0.84 PDK2 (0.51) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL7053753 0.84 PDK2 (0.43) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL6538799 0.84 MEN1 (0.57) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL30771578 0.84 MEN1 (0.57) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL16963572 0.83 GFER (0.43) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL4660239 0.83 MEN1 (0.68) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL19521771 0.80 PDK2 (0.58) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL7050425 0.80 MAPT (0.73) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL6297045 0.78 PDK2 (0.56) MEN1KMT2ASMN1; SMN2KDM4ELMNA
SCHEMBL7055767 0.78 ESR1 (0.51) MEN1KMT2ASMN1; SMN2KDM4ELMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
US-20210292545-A1 PREPREG TORAY INDUSTRIES, INC. (JP) 2021-09-23 US disclosed
EP-3842481-A1 PREPREG Toray Industries, Inc. (JP) 2021-06-30 EP disclosed
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP disclosed
EP-0851887-B1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING & MFG (US) 2003-04-23 EP disclosed
US-6054221-A A FLUORENE AMINE CURATIVE PARTIALLY MELT DISSOLVED AND PARTIALLY DISPERSED AS A SOLID IN AN AROMATIC POLYEPOXIDE; PREPREGS HAVING TACK WITH GOOD SHELF LIFE PROPERTIES; NON-DIFFUSING; COMPARABLE GLASS TRANSITION TEMPERATURES 3M INNOVATIVE PROPERTIES COMPANY (US) 2000-04-25 US disclosed
US-6007917-A FOR MAKING LIGHTWEIGHT, HIGH STRENGH AIRCRAFT COMPONENTS 3M INNOVATIVE PROPERTIES COMPANY (US) 1999-12-28 US disclosed
EP-0851887-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-07-08 EP disclosed
US-5728755-A EXHIBIT TACK AND GOOD SHELF LIFE, LITTLE RESIN MIGRATION AND GLASS TRANSITION TEMPERATURE SIMILAR TO THOSE CURED NEAT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-03-17 US disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591174-A1 REWORKABLE ADHESIVE FOR ELECTRONIC APPLICATIONS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1991018957-A1 REWORKABLE ADHESIVE FOR ELECTRONIC APPLICATIONS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1991-12-12 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
EP-0274209-A1 Glycidylethers of fluorene-containing bisphenols MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1988-07-13 EP disclosed
US-4707534-A PROTECTIVE COATINGS, POLYEPOXIDES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-11-17 US disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed