SCHEMBL4662528

SCHEMBL4662528

CCSCCCS(=O)(=O)O.[NaH]

nearest known ligand 0.45

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.45
APP P05067 1/20 0.41
PTGS1 P23219 1/20 0.33
PDE4A P27815 1/20 0.33
LMNA P02545 1/20 0.33
SLC6A6 P31641 1/20 0.33
CYP2C19 P33261 1/20 0.33
BLM P54132 1/20 0.33
CA2 P00918 1/20 0.32
EPHX2 P34913 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9883940 0.98 TSHR (0.46) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL15345876 0.91 TSHR (0.45) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL8459073 0.86 TSHR (0.38) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL565134 0.85 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL1261334 0.83
SCHEMBL27175673 0.83 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL564743 0.83 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL517829 0.83 APP (0.50) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL16638883 0.82 APP (0.41) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL15297851 0.80 APP (0.48) APPPTGS1PDE4ALMNASLC6A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2004404-B1 COPPER ELECTROPLATING OF PRINTING CYLINDERS MACDERMID INC (US) 2013-04-17 EP claimed
EP-2004404-A2 COPPER ELECTROPLATING OF PRINTING CYLINDERS MacDermid, Incorporated (US) 2008-12-24 EP claimed
WO-2007120365-A2 COPPER ELECTROPLATING OF PRINTING CYLINDERS MACDERMID, INCORPORATED (US) 2007-10-25 WO claimed
US-7153408-B1 Copper electroplating of printing cylinders CITIBANK, N.A. 2006-12-26 US claimed
EP-2004404-B1 COPPER ELECTROPLATING OF PRINTING CYLINDERS MACDERMID INC (US) 2013-04-17 EP disclosed
EP-2004404-A2 COPPER ELECTROPLATING OF PRINTING CYLINDERS MacDermid, Incorporated (US) 2008-12-24 EP disclosed
WO-2007120365-A2 COPPER ELECTROPLATING OF PRINTING CYLINDERS MACDERMID, INCORPORATED (US) 2007-10-25 WO disclosed
US-7153408-B1 Copper electroplating of printing cylinders CITIBANK, N.A. 2006-12-26 US disclosed