SCHEMBL467508

SCHEMBL467508

CO[SiH](OC)C(C)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL467705 0.74
SCHEMBL15541471 0.69
SCHEMBL69710 0.69
SCHEMBL5404685 0.65
SCHEMBL613158 0.65
SCHEMBL10706927 0.65 LMNA (0.32)
SCHEMBL4087471 0.65
SCHEMBL8852226 0.64
SCHEMBL5410416 0.64
SCHEMBL5419933 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109749123-B Rubber powder with vulcanization promoting effect and preparation method thereof 华南理工大学 2021-06-08 CN claimed
US-7863398-B2 Process for making hydrolyzable silylated polymers MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-01-04 US claimed
EP-2134767-B1 PROCESS FOR MAKING HYDROLYZABLE SILYLATED POLYMERS MOMENTIVE PERFORMANCE MAT INC (US) 2010-09-15 EP claimed
EP-2134767-A1 PROCESS FOR MAKING HYDROLYZABLE SILYLATED POLYMERS Momentive Performance Materials Inc. (US) 2009-12-23 EP claimed
US-20080242825-A1 Process for making hydrolyzable silylated polymers MOMENTIVE PERFORMANCE MATERIALS INC. 2008-10-02 US claimed
WO-2008118460-A1 PROCESS FOR MAKING HYDROLYZABLE SILYLATED POLYMERS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-10-02 WO claimed
WO-2024009957-A1 LIGHT/MOISTURE CURABLE RESIN COMPOSITION, CURED PRODUCT, USE OF LIGHT/MOISTURE CURABLE RESIN COMPOSITION, AND END FACE PROTECTION METHOD 積水化学工業株式会社 2024-01-11 WO disclosed
WO-2023176795-A1 LIGHT-MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENT, AND ADHESIVE AGENT FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-09-21 WO disclosed
WO-2023153514-A1 PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-08-17 WO disclosed
CN-110461856-B Method for producing alkoxyhydrosilane and method for producing alkoxyhalosilane 株式会社钟化 2023-01-10 CN disclosed
WO-2022260053-A1 PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, CURED BODY, AND ELECTRONIC COMPONENT 積水化学工業株式会社 2022-12-15 WO disclosed
CN-109749123-B Rubber powder with vulcanization promoting effect and preparation method thereof 华南理工大学 2021-06-08 CN disclosed
EP-2604655-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2020-12-09 EP disclosed
CN-102140108-A Method for producing alkylhalohydrosilane compound KANEKA CORP 2011-08-03 CN disclosed
CN-102046700-A Fixing material comprising silane compound polymer and photonic device sealed body LINTEC CORP 2011-05-04 CN disclosed
CN-102037000-A Process for producing alpha-hetero-substituted alkylhalohydrosilanes and use thereof KANEKA CORP 2011-04-27 CN disclosed
EP-2308884-A1 METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF Kaneka Corporation (JP) 2011-04-13 EP disclosed
CN-102007165-A Molding material comprising polyorganosiloxane compound, sealing material, and optical element sealing body LINTEC CORP 2011-04-06 CN disclosed
EP-0267406-B1 PROCESS FOR THE PREPARATION OF ALKOXY SILANES BAYER AG (DE) 1992-01-02 EP disclosed
US-4762938-A Process for the preparation of alkoxysilanes BAYER AKTIENGESELLSCHAFT (DE) 1988-08-09 US disclosed