SCHEMBL471867

SCHEMBL471867

O=C(O)c1cc2cc3ccccc3cc2c(C(=O)O)c1C(=O)O

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.55
ALDH1A1 P00352 3/20 0.55
MEN1 O00255 3/20 0.55
KMT2A Q03164 3/20 0.55
HPGD P15428 2/20 0.55
CYP1A2 P05177 2/20 0.55
CYP2C19 P33261 2/20 0.55
HSD17B10 Q99714 2/20 0.55
GLA P06280 1/20 0.55
IDO1 P14902 1/20 0.52
TP53 P04637 1/20 0.46
HIF1A Q16665 1/20 0.46
RXFP1 Q9HBX9 1/20 0.46
MAPT P10636 2/20 0.46
GFER P55789 1/20 0.46
NGLY1 Q96IV0 1/20 0.46
NR4A1 P22736 1/20 0.46
NR4A2 P43354 1/20 0.46
NR4A3 Q92570 1/20 0.46
PTPN1 P18031 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19253346 0.95 IDO1 (0.50) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL7058415 0.89 KDM4E (0.47) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL29628947 0.86 KDM4E (0.50) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL31401681 0.85 MEN1 (0.70) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL28652 0.85 MEN1 (0.70) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL30354048 0.85 MEN1 (0.70) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL26963240 0.84 IDO1 (0.56) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL31125071 0.84 KDM4E (0.69) KDM4EALDH1A1MEN1KMT2AHPGD
Cesium SCHEMBL31214843 0.83 MEN1 (0.68) KDM4EALDH1A1MEN1KMT2AHPGD
SCHEMBL10417205 0.83 MEN1 (0.68) KDM4EALDH1A1MEN1KMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 147 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6392091-B1 None US claimed
EP-3227261-B1 ESTER PLASTICIZERS BASED ON ETHYLHEXANOL AND PROPYLHEPTANOL EMERY OLEOCHEMICALS GMBH (DE) 2019-07-03 EP claimed
CN-108192133-A Ester plasticizer and application thereof 金华观瑞科技有限公司 2018-06-22 CN claimed
CN-108047611-A PVC composition containing ester plasticizer 金华观瑞科技有限公司 2018-05-18 CN claimed
US-20170313851-A1 ESTER PLASTICIZERS BASED ON ETHYLHEXANOL AND PROPYLHEPTANOL EMERY OLEOCHEMICALS GMBH (CH) 2017-11-02 US claimed
CN-107250098-A Ester plasticiser based on ethyl hexanol and propyl enanthol 埃默里油脂化学有限公司 2017-10-13 CN claimed
EP-3227261-A1 ESTER PLASTICIZERS BASED ON ETHYLHEXANOL AND PROPYLHEPTANOL Emery Oleochemicals GmbH (DE) 2017-10-11 EP claimed
WO-2016086977-A1 ESTER PLASTICIZERS BASED ON ETHYLHEXANOL AND PROPYLHEPTANOL AMRIL AG (CH) 2016-06-09 WO claimed
US-6392091-B2 SOLVENT EXTRACTION LIN TSONG-DAR VINCENT (US) 2002-05-21 US claimed
US-6291707-B1 DISSOLVING ORGANIC ACID, OR ITS DERIVATIVE IN A BASE COMPOUND SELECTED FROM OF AMINES AND MORPHOLINES; REMOVING IMPURITIES; RECOVERING ACID OR ITS DERIVATIVE; REMOVING ADSORBED BASE COMPOUND TO OBTAIN PURIFIED ACID OR ITS DERIVATIVE LIN TSONG-DAR VINCENT (US) 2001-09-18 US claimed
US-12516139-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-06 US disclosed
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
US-12221523-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-02-11 US disclosed
CN-117529509-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2025-01-10 CN disclosed
CN-1446701-A Planography strut attachment, mfg. method for original plate of planography printing plate and planography printing plate FUJI PHOTO FILM CO LTD (JP) 2003-10-08 CN disclosed
EP-1348570-A2 Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2003-10-01 EP disclosed
US-20030068455-A1 Polyester based resin composition and molded product therefrom MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2003-04-10 US disclosed
EP-1262524-A2 Polyester based resin composition and molded product therefrom MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2002-12-04 EP disclosed
EP-1046674-A2 Polyester resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2000-10-25 EP disclosed