SCHEMBL47312

SCHEMBL47312

CCCCNS(=O)(=O)C(F)(F)F

nearest known ligand 0.84

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.84
CA1 P00915 7/20 0.56
CA2 P00918 7/20 0.56
CA12 O43570 3/20 0.56
CA14 Q9ULX7 3/20 0.56
CA7 P43166 2/20 0.56
PPARA Q07869 4/20 0.43
MEN1 O00255 1/20 0.36
HTT P42858 1/20 0.36
KMT2A Q03164 1/20 0.36
ADH1B P00325 1/20 0.34
ADH1C P00326 1/20 0.34
ADH1A P07327 1/20 0.34
ADH7 P40394 1/20 0.34
CA9 Q16790 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL7870216 0.98 EPHX1 (0.81) EPHX1CA1CA2CA12CA14
SCHEMBL1321109 0.93 EPHX1 (0.96) EPHX1CA1CA2CA12CA14
SCHEMBL1318738 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL1321631 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL1319977 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL1319861 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL15116347 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL1318327 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL1319040 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14
SCHEMBL15116365 0.91 EPHX1 (1.00) EPHX1CA1CA2CA12CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 454 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119137096-A Trifluoromethanesulfonyl a composition of the agent trifluoromethanesulfonyl oxy compounds or Process for producing trifluoromethanesulfonyl compound 中央硝子株式会社 2024-12-13 CN disclosed
US-12032290-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 US disclosed
US-11874601-B2 Resist composition, method of forming resist pattern, compound, and acid diffusion-controlling agent TOKYO OHKA KOGYO CO., LTD. (JP) 2024-01-16 US disclosed
US-11874601-B2 Resist composition, method of forming resist pattern, compound, and acid diffusion-controlling agent TOKYO OHKA KOGYO CO., LTD. (JP) 2024-01-16 US disclosed
US-11835849-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-12-05 US disclosed
US-11835857-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-12-05 US disclosed
US-11835857-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-12-05 US disclosed
US-11829068-B2 Resist composition, method of forming resist pattern, compound, and resin TOKYO OHKA KOGYO CO., LTD. (JP) 2023-11-28 US disclosed
US-11829068-B2 Resist composition, method of forming resist pattern, compound, and resin TOKYO OHKA KOGYO CO., LTD. (JP) 2023-11-28 US disclosed
US-11822240-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-11-21 US disclosed
WO-2011034176-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER AND POLYMERIZABLE COMPOUND JSR株式会社 (JP) 2011-03-24 WO disclosed
US-20100285405-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-11-11 US disclosed
US-20100285405-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-11-11 US disclosed
US-7759047-B2 Resist protective film composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-07-20 US disclosed
US-7670750-B2 Polymer, resist protective coating material, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-03-02 US disclosed
US-20090208867-A1 Resist Composition, Resist Protective Coating Composition, and Patterning Process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-08-20 US disclosed
US-20080085466-A1 Polymer, resist protective coating material, and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2008-04-10 US disclosed
US-20070275326-A1 Resist protective film composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-11-29 US disclosed
US-4293441-A FLUOROALIPHATICSULFONAMIDO PHOSPHONIC ACID, ETHYLENE GLYCOL OR PROPYLENE GLYCOL MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1981-10-06 US disclosed
US-4202706-A Corrosion resistance treatment of aluminum with N-alkyl-fluoroaliphaticsulfonamidophosphonic acids and salts thereof MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1980-05-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11835849-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device RER1, TERB1, TRRAP EPHX1 264/4885CA1 2140/4885CA2 3808/4885
US-11874601-B2 Resist composition, method of forming resist pattern, compound, and acid diffusion-controlling agent MRPS23, MRPS22, SLC11A2 EPHX1 4516/4885CA1 1150/4885CA2 1207/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.