SCHEMBL473162

SCHEMBL473162

CN(C)C(=O)N(c1ccccc1)c1ccc(Cc2ccc(N(C(=O)N(C)C)c3ccccc3)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 2/20 0.55
LMNA P02545 1/20 0.46
ALDH1A1 P00352 3/20 0.45
TSHR P16473 2/20 0.45
CYP3A4 P08684 1/20 0.45
MAPK1 P28482 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
KMT2A Q03164 3/20 0.43
RAB9A P51151 3/20 0.43
NPC1 O15118 2/20 0.43
POLB P06746 1/20 0.43
HTT P42858 1/20 0.43
GLA P06280 1/20 0.43
HDAC1 Q13547 2/20 0.42
HDAC6 Q9UBN7 2/20 0.42
PLA2G10 O15496 1/20 0.42
PLA2G2A P14555 1/20 0.42
MEN1 O00255 1/20 0.39
PTGIR P43119 1/20 0.39
LTA4H P09960 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL748812 0.87 NPSR1 (0.73) NPSR1ALDH1A1TSHRTDP1KMT2A
SCHEMBL27960846 0.87 NPSR1 (0.73) NPSR1ALDH1A1TSHRTDP1KMT2A
SCHEMBL2231821 0.81 NPSR1 (0.52) NPSR1LMNAALDH1A1TSHRCYP3A4
SCHEMBL27463137 0.80 LMNA (0.56) NPSR1LMNAALDH1A1TSHRCYP3A4
SCHEMBL18780849 0.80 LMNA (0.52) LMNAALDH1A1TSHRCYP3A4MAPK1
SCHEMBL9705901 0.79 NPSR1 (0.40) NPSR1ALDH1A1TSHRCYP3A4MAPK1
SCHEMBL10668893 0.76 NPSR1 (0.57) NPSR1LMNAALDH1A1TSHRCYP3A4
Diphenylmethane SCHEMBL10932258 0.74 LMNA (0.57) LMNAALDH1A1TSHRKMT2ARAB9A
Oxalic Acid SCHEMBL4586651 0.74 ALDH1A1 (0.65) LMNAALDH1A1TSHRCYP3A4MAPK1
SCHEMBL812818 0.73 NPSR1 (1.00) NPSR1ALDH1A1TSHRTDP1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10875976-B2 Heat-curable resin composition, prepreg, and method for producing fiber-reinforced composite using each of same TOHO TENAX CO., LTD. (JP) 2020-12-29 US disclosed
EP-2412741-B1 EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT TORAY INDUSTRIES (JP) 2019-10-23 EP disclosed
EP-3075785-B1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME TOHO TENAX CO LTD (JP) 2019-09-11 EP disclosed
EP-3075785-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME Toho Tenax Co., Ltd. (JP) 2016-10-05 EP disclosed
US-20160280871-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME TOHO TENAX CO., LTD. (JP) 2016-09-29 US disclosed
EP-2690128-B1 PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2015-10-28 EP disclosed
EP-2690128-A1 PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2014-01-29 EP disclosed
US-20130316169-A1 PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2013-11-28 US disclosed
EP-2412741-A1 EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT Toray Industries, Inc. (JP) 2012-02-01 EP disclosed
US-20110319525-A1 EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT TORAY INDUSTRIES, INC. (JP) 2011-12-29 US disclosed